The Chemical Connection: Surface Finishes for PCBs
It’s Only Common Sense: 7 Tips to Focus on What Works
The Marketing Minute: Go Big or Go Home—Long-form Content Is Your Brand’s Best Friend
Estimated reading time: Less than a minute
Trouble in Your Tank: Via Hole Filling and Plugging, Part 2
In my previous column, I presented several options with which to accomplish blind and through-hole via filling. In this edition of “Trouble in Your Tank,” I will discuss filling blind vias and through-holes with polymeric pastes.
Via Fill Paste
Often, the phrase “plugging paste” is used to describe the method and material of completely filling blind vias and through-holes. In general, paste filling material selection is at the request of the end user and indicated for a number of reasons. It has been my experience that major OEMs are driving the industry to migrate to the high-Tg/low-CTE plugging paste formulations for high-density applications. In addition, these formulations are of a non-conductive nature that provides a high-quality plugged via that is cost-effective. Limitations abound depending on PCB thickness, via diameter, and paste properties.
To read this entire column, which appeared in the October issue of PCB007 Magazine, click here.
Share on:
More Columns from Trouble in Your Tank
Trouble in Your Tank: Interconnect Defect—The Three Degrees of SeparationTrouble in Your Tank: Things You Can Do for Better Wet Process Control
Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 5
Trouble in Your Tank: Materials for PWB Fabrication—Drillability and Metallization
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
Trouble in Your Tank: Electrodeposition of Copper, Part 6
Trouble in Your Tank: Electrolytic Copper Plating, Part 5
Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 4