European Conference on Integrated Optics Issues Call for Papers
November 26, 2019 | ECIO 2020Estimated reading time: Less than a minute
The European Conference on Integrated Optics has posted a call for papers. ECIO 2020 takes place June 23-25, 2020, at the Jussieu campus of Sorbonne University in Paris, France.
Conference topics cover waveguide technology and platforms, devices and materials, integrated circuits and applications of photonic integrated circuits (PICs). The most recent advances in photonic integration technologies, such as silicon photonics and III-V optoelectronics, is one of the main features of the conference. Assembly, packaging and hybrid integration techniques are also covered. In addition, the conference aims to discuss novel concepts on materials with unique properties such as 2D materials or phase change materials.
Deadlines
Deadline for paper submission: January 17, 2020 (17:00 CET)
Author notification: February 22, 2020
For more information, visit www.ecio-2020.org.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
ITW EAE Despatch Ovens Now Support ASTM 5423 Testing
10/15/2025 | ITW EAEAs the demand for high-performance electrical insulation materials continues to grow—driven by the rapid expansion of electric vehicles (EVs) and energy storage systems—thermal processing has become a critical step in material development.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Creative Materials to Showcase Innovative Functional Inks for Medical Devices at COMPAMED 2025
10/09/2025 | Creative Materials, Inc.Creative Materials, a leading manufacturer of high-performance functional inks and coatings, is pleased to announce its participation in COMPAMED 2025, taking place November 17–20 in Düsseldorf, Germany.
Jiva Leading the Charge Toward Sustainable Innovation
09/30/2025 | Marcy LaRont, PCB007 MagazineEnvironmental sustainability in business—product circularity—is a high priority these days. “Circularity,” the term meant to replace “recycling,” in its simplest definition, describes a full circle life for electronic products and all their elements. The result is re-use or a near-complete reintroduction of the base materials back into the supply chain, leaving very little left for waste. For what cannot be reused productively, the ultimate hope is to have better, less harmful means of disposal and/or materials that can seamlessly and harmlessly decompose and integrate back into the natural environment. That is where Jiva and Soluboard come in.