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ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung

05/08/2026 | ASE Group
Advanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung. 

FPGA AI Chip Market to Surpass $100M Shipments by 2031 Amid Rapid ASP Decline

05/07/2026 | JPR
Jon Peddie Research (JPR), the market research and consulting firm covering graphics, AI processors, and visual computing, released FPGAs in AI, a new market intelligence report analyzing the emerging class of field-programmable chips designed for AI inference at the edge and in the cloud, and for IoT.

SEMI 3D & Systems Summit to Advance AI, Hybrid Bonding, and Chiplet Ecosystem

05/06/2026 | SEMI
Global experts in advanced semiconductor packaging and 3D integration will convene at the annual SEMI 3D & Systems Summit, June 17–19, 2026, in Dresden, Germany.

Xanadu, EV Group Partner to Build Industrial-Scale Photonic Quantum Hardware

05/05/2026 | PRNewswire
Xanadu Quantum Technologies Ltd., a leading photonic quantum computing company, and EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, announced a strategic partnership to develop critical heterogeneous integration and wafer bonding processes to facilitate the scalability of photonic quantum systems.

U.S. Semiconductor Industry Convenes at Glass4Chips Summit

05/04/2026 | NY CREATES
The 2026 Glass4Chips Summit will bring together leaders and innovators across industry, academia, and government to address a framework for accelerating the adoption of glass substrates in next-generation semiconductor manufacturing and packaging.
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