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Baya Systems Expands to Japan to Support Next-Generation AI Semiconductor Design

08/26/2026 | BUSINESS WIRE
Baya Systems, a pioneer in software-driven, chiplet-ready semiconductor fabric IP, announced its expansion into Japan, one of the world's fastest-growing semiconductor markets.

Liquid Cooling to Reach 53% of High-End AI Infrastructure in 2026

08/17/2026 | TrendForce
According to TrendForce’s latest AI server industry research, continued investment in AI infrastructure and the rapid iteration of AI chips from NVIDIA, AMD, and Google have pushed the TDP of individual chips above 1 kW.

Advanced Chip Packaging Technologies Market to Reach $87.6 Billion by 2030

08/11/2026 | Globe Newswire
The global advanced chip packaging technologies market is projected to grow from $38.6 billion in 2024 to $87.6 billion by 2030, at a compound annual growth rate (CAGR) of 14.8% over the forecast period.

Pasqal Brings Qubit Control On-Chip, Advancing Fault-Tolerant Quantum Computing

08/10/2026 | Globe Newswire
Pasqal, a global leader in neutral-atom quantum computing, announced what it, to its knowledge, believes to be a world-first: the trapping of individual atoms using laser light generated by a photonic integrated circuit (PIC).

NEO Semiconductor Launches NEO.AI Memory Platform to Solve AI's Two Biggest Memory Bottlenecks

08/05/2026 | PRNewswire
NEO Semiconductor, a leading innovator in advanced AI and memory technologies, announced the launch of NEO.AI, its next-generation AI memory platform designed to solve the two most significant memory bottlenecks limiting future artificial intelligence systems: on-chip memory (AI cache) and HBM capacity.
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