Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects

11/21/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and GlobalFoundries.

CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging

11/21/2024 | U.S. Chamber of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.

Cadence Unveils Arm-Based System Chiplet

11/20/2024 | Cadence Design Systems
Cadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement in chiplet technology, showcasing Cadence's commitment to driving industry-leading solutions through its chiplet architecture and framework.

CHIPS for America Announces New Proposed $285 Million Award for CHIPS Manufacturing USA Institute for Digital Twins

11/19/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Department to provide SRC $285 million to establish and operate a Manufacturing USA institute headquartered in Durham, North Carolina.

SIA Commends Finalization of CHIPS Incentives for TSMC

11/18/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of the agreement to allocate incentives to TSMC under the CHIPS and Science Act. The agreement between TSMC and the U.S. Department of Commerce will support the expansion of TSMC’s semiconductor fabs in Arizona.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in