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Hon Hai Research Institute Partners with Taiwan Academic Research Institute and KAUST to Participate in CLEO 2025

05/30/2025 | Foxconn
The research team of the Semiconductor Division of Hon Hai Research Institute, together with the research teams of National Taiwan University and King Abdullah University of Science and Technology in Saudi Arabia, has successfully made breakthroughs in multi-wavelength μ -LED technology to achieve high-speed visible light communication and optical interconnection between chips.

Insights Into a Differentiating Trade/Investment Global Strategy for Electronics

05/27/2025 | I-Connect007 Editorial Team
To better understand the U.S. administration’s actions on global trade policies earlier this spring, Barry Matties and Nolan Johnson met with Richard Cappetto, IPC’s senior director of North American government relations, who highlighted both the challenges and opportunities available to U.S. companies in the recent trade activity. This could include increased domestic manufacturing and supply chain diversification.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/23/2025 | Marcy LaRont, I-Connect007
In the electronics manufacturing industry, the global PCB market is estimated to reach $86.5 billion by 2029, a 5.9% annual growth, per IPC’s Global Market Forecast, and the global new cycle is still being dominated by U.S. news. This week, we are talking about the status of the CHIPS Act and what the new tax and incentives bill does and does not include. We also take a minute for some marketing wisdom to shed light in a challenging and noisy market environment.

GlobalFoundries Partners with A*STAR to Accelerate Advanced Packaging Innovation

05/22/2025 | GlobalFoundries
GlobalFoundries (GF)  announced plans to expand its capabilities in advanced packaging through a new Memorandum of Understanding (MOU) signed with the Agency for Science, Technology and Research (A*STAR), Singapore’s lead public sector research and development (R&D) agency.

OKI Launches 124-Layer Circuit Board Technology

05/22/2025 | Andy Shaughnessy, Design007 Magazine
During PCB East, OKI Circuit Technology unveiled its latest innovation: a 124-layer printed circuit board. In this interview, “Dennie” Kazuo Kawahara, president of OKI Data Americas, and Eiichi Aki, sales and marketing specialist at OKI Circuit Technology, shared their insights into this feat. With plans for mass production starting in October, this board is designed for high-bandwidth memory applications, accommodating the demanding requirements of AI chips.
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