Samsung Receiving Industry’s First Global Recognition for Environmental Sustainability
December 3, 2019 | Samsung Electronics Co., Ltd.Estimated reading time: 1 minute

Samsung Electronics, a world leader in advanced memory technology, announced that its 512-gigabyte (GB) embedded Universal Flash Storage (eUFS) 3.0 was awarded Carbon Footprint and Water Footprint Certifications from the highly respected UK-based Carbon Trust during a ceremony at the British Embassy in Seoul, Korea. Samsung’s 512GB eUFS 3.0 is the first mobile memory in the industry to be recognized by an international certifying organization, which was made possible through the company’s extensive efforts to reduce carbon and water footprints.
The Carbon Trust is a globally accredited non-profit certification body established by the British government to accelerate the move to a sustainable, low-carbon economy. Each certification by the Carbon Trust was made after a thorough assessment of the environmental impact of carbon emissions and water usage before and throughout the production cycle, based on international standards*.
“We are extremely pleased that our cutting-edge memory technologies not only demonstrate our capability to overcome more challenging process complexities, but also are recognized for their environmental sustainability,” said Chanhoon Park, executive vice president and head of Giheung Hwaseong Pyeongtaek Complex at Samsung Electronics. “Samsung will continue to create memory solutions that provide the highest levels of speed, capacity and power efficiency at extremely small geometries for end-users worldwide.”
Samsung’s Semiconductor Innovations Enable Sustainable Production
Based on the company’s fifth-generation (90+ layers) V-NAND, Samsung’s 512GB eUFS 3.0 provides optimal speed, power efficiency and productivity to deliver twice the capacity and 2.1 times the sequential speed of its fourth generation (64 layers) V-NAND-based 256GB eUFS 2.1, while requiring 30 percent less operating voltage. Additionally, Samsung’s fifth-generation V-NAND utilizes a unique etching technology that pierces more than 90 cell layers in a single precise step. This allows the chip to have nearly 1.5 times more stacked layers than the previous generation and accommodate a 25-percent reduction in chip size. Such innovations help to minimize the overall increase in carbon and water footprints for each V-NAND cell layer.
Samsung is also being awarded Environmental Product Declaration (EPD) labels for its ‘1-terabyte (TB) eUFS 2.1’ and its ‘fifth-generation 512-gigabit (Gb) V-NAND’ by the Korean Ministry of Environment at today’s ceremony.
Samsung plans to actively expand the adoption of its highly sustainable, high-capacity premium memory solutions into many more flagship smartphones and further strengthen global partnerships for its next-generation memory technologies.
Suggested Items
Lam Research Donates Leading-Edge Etch System to Accelerate Nanofabrication R&D at UC Berkeley
04/17/2025 | PRNewswireLam Research Corp. announced the donation of its innovative multi-chamber semiconductor etching system to the Marvell Nanofabrication Laboratory at the University of California, Berkeley to advance research and development (R&D) for next-generation chip technologies.
Chemcut Corporation Announces Atlantic Micro Tool Expanded Sales Territory
03/11/2025 | Chemcut CorporationChemcut Corporation, the US based manufacturer of Wet Process Equipment, has expanded Atlantic Micro Tools sales territory to include DE, MD, VA, WV, NY, PA, NC, SC, TN, GA, AL, FL, MS, Ontario. Atlantic Micro Tool has represented Chemcut for over 15 years in the States of ME, NH, VT, RI, CT, NJ, New York City MA, NY counties of Nassau, Suffolk, Quebec & Eastern Ontario.
TRUMPF, SCHMID Group Enable Cost-effective High-speed Chips
01/24/2025 | SCHMID GroupTRUMPF and the SCHMID Group are developing an innovative manufacturing process for the latest microchip generation for the global chip industry.
Connect the Dots: Designing for Reality: Strip-Etch-Strip
12/05/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we focused on pattern plating. At this point, we are close to completing our boards and ready for the strip-etch-strip (SES) process. By this stage of the manufacturing process, we have laminated all the internal layers together, drilled the through-holes, applied the image to the external layers through photoresist, plated the copper in those channels to beef up the copper thickness for traces, pads, and through-holes, added a layer of electrolytic tin over the top of that copper to protect it during subsequent stages of production.
SCHMID Group Unveils Revolutionary Hyper Loop System (HLS) for Precision Etching with Sustainable Technology
11/07/2024 | SCHMID GroupThe SCHMID Group is excited to introduce the Hyper Loop System (HLS), an innovative solution setting new standards in etching technology by combining high efficiency with sustainable benefits.