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Advanced Electronics Packaging Digest

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Suggested Items

It’s Only Common Sense: How to Demonstrate Grace Under Pressure During Tough Times

09/04/2026 | Dan Beaulieu -- Column: It's Only Common Sense
Anyone can feel confident when orders are flowing, materials are available, lead times are reasonable, and customers are happy. It’s easier to return calls, make promises, smile during meetings, and talk about partnership. The real test comes when everything goes wrong. True professionals demonstrate grace under pressure. They remain calm when customers are angry and tell the truth even when it is uncomfortable. They accept responsibility, search for solutions, and keep moving forward.

It's Only Common Sense: Your Expertise Builds Your Brand

08/31/2026 | Dan Beaulieu -- Column: It's Only Common Sense
Before a prospective customer ever calls you, visits your facility, or sends you an RFQ, there’s a good chance they’ve already checked you out. What did they find? Your website, technical articles, LinkedIn posts, case studies, and even what turns up in an AI search are forming an impression of your company before your salesperson ever gets in the door. Like it or not, that’s part of selling today.

Happy’s Tech Talk #49: Stop! Do You Have a Digital Strategy for the Future?

08/11/2026 | Happy Holden -- Column: Happy’s Tech Talk
I am sure you have been wondering how you will survive this new age of AI, tariffs, China, and the ever-increasing cost of materials and PCB equipment. You cannot just sit back and watch it roll over you. If you wish for your company to survive, you need a “digitalization strategy,” and that includes a way to afford it.

Nomenil Aims to Make Additive Manufacturing Production-Ready

07/09/2026 | Marcy LaRont, I-Connect007
Can additive manufacturing finally move beyond niche applications and into mainstream PCB production? Nomenil founders Bas Le Grand and Dr. Luca Gautero believe the answer lies not in the hardware, but in the software. Drawing on years of inkjet experience, they're developing tools designed to make additive manufacturing more predictable, scalable, and accessible for manufacturers.

Every Layer Interconnect: The Promise, the Pain, and the Practical Limits

07/02/2026 | Anaya Vardya, American Standard Circuits
Every layer interconnect (ELIC) is an architectural statement about how a PCB is built, signaling a fundamental shift in how we think about routing density, vertical interconnect, and the relationship between design and fabrication. To understand what ELIC solves, you have to understand what it replaces. Traditional HDI construction uses a rigid core with sequential build-up layers on one or both sides:configurations such as 2-4-2 or 3-2-3.
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