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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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NOTE Opens New Torsby Plant to Boost Sweden's Defence and Critical Sector Supply

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Connect the Dots: What Designers Should Know About Non-conductive Via Fill

05/28/2026 | Matt Stevenson -- Column: Connect the Dots
The rapid advance of technology is driving changes in electronics that require increasingly smaller boards capable of handling higher signal speeds and supporting more robust software applications. Manufacturers are increasingly called upon to produce ultra high density interconnect (UHDI) PCBs, so it’s important to tune our production capabilities and customer service models to this trend. Non-conductive via fill (NCVF) offers a cost-effective, reliable manufacturing method that accommodates the densely packed, fine-pitch ball grid array (BGA) components present in UHDI designs.

Standard of Excellence: Building Excellence From the Inside Out

05/27/2026 | Anaya Vardya -- Column: Standard of Excellence
You can’t have a world-class product without a world-class mindset. Every layer, lot, and customer success begins long before a board hits the lamination press or the AOI line. It begins with how people think, care, and take ownership of their work. Culture, in the truest sense, is process control. It governs consistency, integrity, and pride as surely as SPC charts and traveler sheets. If the culture isn’t right, neither will the product be.

Three Key Takeaways on Material Management From Cogiscan’s Latest White Papers

05/27/2026 | I-Connect007 Editorial Team
Effective material management has become increasingly critical as PCB assembly operations face mounting pressure to improve efficiency, control costs, and maintain quality in complex manufacturing environments. To help electronics manufacturers navigate these challenges, Cogiscan has contributed two complementary white papers to the I-Connect007 Industry Resource Center, offering practical strategies for improving material visibility, traceability, and production performance.
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