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American Standard Circuits to Exhibit at IMS 2025

06/12/2025 | American Standard Circuits
Anaya Vardya, President and CEO of American Standard Circuits & ASC Sunstone Circuits, announced that his companies will exhibit at the IEEE International Microwave Symposium (IMS 2025), taking place June 15-20, 2025, at San Francisco’s Moscone Center.

Roll-to-Roll Technologies for Flexible Devices Set to Grow at 11.5% CAGR

06/11/2025 | GlobeNewswire
According to the latest study from BCC Research, the “Global Markets for Roll-to-Roll Technologies for Flexible Devices” is expected to reach $69.8 billion by the end of 2029 at a compound annual growth rate (CAGR) of 11.5% from 2024 to 2029.

Flex Announces Collaboration with MIT to Advance the Future of Manufacturing with AI and Automation

06/09/2025 | Flex
Flex announced a strategic collaboration with the Massachusetts Institute of Technology (MIT) on its new Initiative for New Manufacturing (INM) — a bold, Institute-wide effort to reimagine industrial production, drive innovation through advanced technologies, and strengthen U.S. manufacturing competitiveness.

Amphenol Printed Circuits Brings Its Boards to the 2025 IMSI

05/29/2025 | Amphenol Printed Circuits
Amphenol Printed Circuits will be offering a small but impressive sample of its vast design, manufacturing, and test capabilities in Radio Frequency (RF) printed circuit boards (PCBs) Rigid-Flex/Flex and backplanes at the 2025 IEEE MTT-S International Microwave Symposium exhibition.

Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics

05/20/2025 | Jerome Larez -- Column: Global PCB Connections
In the past decade, flex and rigid-flex PCB technology has become the fastest-growing market segment. As an increasing number of PCB companies develop the capabilities to fabricate this technology, PCB designers are becoming comfortable incorporating these designs into their products.
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