AIRBUS Drives Optima Photonics Payload Technology to Next Level
December 16, 2019 | AirbusEstimated reading time: 1 minute
Airbus has validated and demonstrated photonic satellite payload technology to Technology Readiness Level 6, the last level before prototype in orbit, through the OPTIMA Horizon 2020 project. This proof of concept demonstrator brings the use of photonic payloads in telecommunications satellites one step closer. Photonic payloads have the potential to revolutionise the design, capacity and capability of future generations of telecommunications satellites.
Photonic payloads will use light to transfer the signals throughout the spacecraft, replacing current radio frequency (RF) technologies, allowing for the development of more efficient and powerful satellites which are able to meet the increasing complexity and sophistication required by customers.
OPTIMA takes into account the future evolution of telecom satellite payloads and inter-satellite links which are expected to enter the terabit per second and multi-Gb/s "era" in the 2020 horizon.
OPTIMA technology enables the design of such payloads with significant reduction of mass, volume and power consumption against full microwave approaches, whereas Photonic Integrated Circuits enable low overall production and integration costs.
The technology developed in OPTIMA will see the sustained entry of photonics into telecom satellite payloads. This will enable easier capacity upgrades of multi-beam telecommunication satellites and also leverage the R&D investment to address next generation coherent inter-satellite links with fully integrated and qualified components.
Javad Anzalchi, Airbus project manager and technical lead said: “By bringing together industry partners, we have managed to develop, demonstrate, and raise the technology readiness level of photonics for applications in space. Using the low power equipments developed in OPTIMA, enables us to achieve high capacity payloads and multi-Gb/s inter-satellite links with considerable savings in power, mass and footprint.”
The OPTIMA project, led by Airbus in Stevenage and part of Horizon 2020 funded by the European Commission, comprises specialist partners from across Europe, including: DAS Photonics (Spain), CORDON Electronics (Italy), SODERN (France), Huber+Suhner Polatis (UK) and IMEC (Belgium).
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.