57th DAC Designer and IP Track Submission Site Open
December 19, 2019 | Business WireEstimated reading time: 3 minutes

The Design Automation Conference (DAC) is now accepting submissions for the 57th DAC Designer and IP Track. This is an opportunity for engineers and developers around the world to help shape the future by sharing their technical insights at the premier event devoted to the design and design automation of electronic chips to systems.
The 57th DAC will be held at Moscone West Center in San Francisco from July 19-23, 2020. DAC will co-locate with SemiCon West 2020, which is being held at the Moscone Center, North and South Halls, July 21-23, 2020. The Designer and IP Tracks bring together designers, users and experts from across the globe to present their design experiences on effective design flows, methods, and tool usage. Each track offers a unique opportunity to network with and learn from other industry experts.
“The focus of the Designer Track is on the flows and methodologies deployed for ASIC design, verification, implementation and software integration by the user,” said Designer and IP Track Chair, Renu Mehra of Synopsys. “This track covers core EDA front-end and back-end topics and also focuses on verticals including autonomous systems, machine learning, security and cloud. The Designer Track is the only one of its kind, developed exclusively by DAC to provide EDA tool users, hardware designers, software engineers, and application engineers the opportunity to share knowledge and experiences with each other.”
“The IP Track at DAC has grown significantly over the past five years since inception,” said IP Track Co-Chair, Randy Fish of UltraSoC. “The key to the growth is it not only brings together the entire IP, electronic design ecosystem under one roof for three days but the track is targeted specifically at practitioners. So, whether you are an IC designer, IP core designer, IP ecosystem provider, embedded software developer, automotive electronics engineer, security expert or engineering manager, the IP Track is the place to meet and share your experiences.”
The submission process for both tracks is easy: Submit a 100-word description of your presentation with six slides. Submissions may describe the application of tools to the design of a novel electronic system or the integration of EDA tools within a design flow or methodology to produce such systems. The Designer Track and IP Track differ from vendor-specific user forums in that they are not tied to a specific EDA vendor.
Designer Track Submissions: www.dac.com/submission-categories/designer-track
The DAC Designer Track committee is looking for submissions that tackle relevant topics and provide high-quality content which target challenges, innovations and trends in chip design. Categories include:
- Front-end silicon design
- Back-end silicon design
- Automotive
- Security
- Machine learning
- Cloud applications
- IoT
IP Track Submissions: https://www.dac.com/submission-categories/ip-track
IP Track submissions may describe the overall design and/or application of tools for creating the hardware, IP and/or software components of a novel electronic system. The IP Track committee is specifically seeking contributions from:
- System engineers
- Hardware designers
- Embedded software developers
- Application engineers
- Vendor/customer teams
Documented tool use may target electronic design and system design at all levels of abstraction and across all application domains.
Presentation and Poster Format
Based on Program Committee evaluation, Designer Track and IP Track submissions may be accepted in either presentation and poster form or poster-only form. A Best Presentation award, based on both the quality of the submission and the DAC presentation itself, will be selected from each of the Front-end and Back-end Designer Tracks and IP Track presentations.
Accepted Designer Track and IP Track presentations and posters are not included in the DAC proceedings. However, accepted Designer Track and IP Track submissions (both posters and presentation slides) will be made available on the DAC website after the conference as a part of the DAC Archives.
The deadline for all Designer and IP Track submissions is January 22, 2020. For additional submission information and deadlines, please visit www.dac.com under Call for Contributions or https://www.dac.com/submission-categories/designer-track#questions.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
Global Citizenship: Together for a Perfect PCB Solution
09/10/2025 | Tom Yang -- Column: Global CitizenshipIf there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in China, or design innovations in Silicon Valley, the PCB industry thrives on collaboration.
The Shaughnessy Report: Winning the Signal Integrity Battle
09/09/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportWhen I first started covering this industry in 1999, signal integrity was the hip new thing in PCB design. Conference classes on signal integrity were packed to the walls, and an SI article was guaranteed to get a lot of reads.
The Signal Integrity Issue: Design007 Magazine September 2025
09/09/2025 | I-Connect007 Editorial TeamAs the saying goes, “If you don’t have signal integrity problems now, you will eventually.” This month, our experts share a variety of design techniques that can help PCB designers and design engineers achieve signal integrity.