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MacDermid Alpha to Present Original Research at IPC APEX Conference and Expo 2020
December 20, 2019 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature three original research presentations during this year’s IPC APEX Conference and Expo, February 1-6, in San Diego, California.
MacDermid Alpha will present three papers during the technical conference. On Tuesday, February 4, Dr. Karen Tellefsen, Senior Scientist, will present "Advanced SIR Testing for Trapped Solder Paste Flux Residue." This paper will cover the importance of developing an SIR/ECM test methodology to support the development and implementation of new solder pastes being developed to provide better electrochemical reliability to meet the challenges of expanding BTC use in electronics assembly.
On Wednesday, February 5, Dr. Saminda Dharmarathna, Senior Research Scientist, will present "Acid Copper Electroplating Processes With Excellent V-Pit Resistance for Flash Etching." Sam will discuss a one-step DC copper plating process allowing excellent via fill and through hole capabilities in a single plating bath for core layers of HDI and IC substrates.
Lenora Clark, Director of Autonomous Driving and Safety Technology for MacDermid Alpha Automotive Solutions, will present on Thursday, February 6, on "Material Considerations for Automotive RADAR Designs." Clark’s paper will cover the importance of chemical process changes and material considerations to meet the reliability requirements of RADAR module builds. “The systems respond to navigation challenges which often remove the driver from the decision-making process.” said Clark. “Due to this, the reliability of advanced safety systems is critical.”
The use of low temperature solders will be the focus of the poster presentation, "Using Low Temperature Solder to Attach Brass Parts to a Copper Pad," by Dr. Traian Cucu, G.A.T.E Leader at MacDermid Alpha Electronics Solutions. This poster will explore the advantages and challenges of joint formation using low temperature solders as pertains to attachment of brass components to a pad.
To learn more about MacDermid Alpha’s materials solutions for optimizing electronics reliability and assembly, visit our IPC APEX Booth #1824 or our website: www.macdermidalpha.com.
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