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BTU International, Inc., a leading supplier of advanced thermal processing equipment for electronics manufacturing, is pleased to announce that Fred Dimock, Manager of Process Technology, will participate in a panel discussion on vacuum reflow with respected industry experts. The panel is scheduled to take place Thursday, Jan. 16, 2020, at L3Harris Technologies in Palm Bay, Florida.
Dimock is the primary author of several papers on void reduction using vacuum reflow, co-authored with the Advanced Process Lab and Auburn University. In addition, he has led vacuum reflow workshops at the American Competitiveness Institute.
Dimock has taught numerous SMTA solder reflow classes and has participated in the 5-45 subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard. He wrote the chapter on solder reflow for the ‘Handbook of Electronic Assembly’ and ‘A Guide to SMTA Certification’ by Dr. Lasky and Jim Hall.
Dimock holds an Associate’s Degree in Mechanical Design from Wentworth in Boston and a Bachelor’s Degree in Ceramic Engineering from the State University of New York at Alfred (SUNY). He has been recognized as a Distinguished Speaker status at SMTA Guadalajara and received several Best Vendor Presentation awards at the SMTA East China conferences.
