Defense Speak Interpreted: Update on the Continuing Resolution and Budget Process for Defense
American Made Advocacy: Reshoring—About Trust, Not Just Geography
Beyond the Board: The Future of Innovation—Why the Electronics Industry Needs You
VJ Electronix to Show Newest Component Counting System and Rework Systems at APEX 2020
January 6, 2020 | VJ ElectronixEstimated reading time: 1 minute
VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, will exhibit in Booth 3627 at the 2020 IPC APEX EXPO in San Diego, CA., Feb. 4−6, 2020. The company will demonstrate the latest enhancements to its XQuik X-ray Component Counter series and its Summit Series Rework product lines.
The VJ Electronix XQIII is the fastest component counter available on the market with 10 seconds per reel count time. The XQIII does not require models, libraries or a connection to the cloud. The system’s automatic algorithms recognize components. The built-in barcode reader eliminates the extra manual scanning step. Unique imaging technology provides the greatest count accuracy.
The XQII and XQuik III are both designed to be used stand alone or with full material handling automation. The built in link to your MES system provides data transfer including reel ID and count, as well as user configurable fields such as operator ID, timestamp, part number, etc. The XQuik III and XQII series counters remain best in class.
The Industry’s leading Summit iSeries Rework products will also be on display. iSeries systems are an improved version of the world’s most popular rework system. VJE has maintained all the benefits of high efficiency convection heating and the renowned 1-2-3-Go interface, coupled with updated technology for greater reliability and an improved price point. Further refinements enhance the system’s performance with ultra-small components like 01005s, while maintaining its capabilities with large boards, oversized CPU sockets, connectors and large BGAs up to 120x120mm.
Share on:
Suggested Items
Indium Wins EM Asia Innovation Award
05/01/2025 | Indium CorporationIndium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.
Elephantech, Logitech Together Drive Disruptive Electronics Innovation
05/01/2025 | ElephantechElephantech Inc. announced a groundbreaking collaboration with Logitech International to revolutionize peripherals manufacturing and the printed circuit board (PCB) industry.
Summit Interconnect Hollister Elevates PCB Prototyping with New TiTAN Direct Imaging System from Technica USA
05/01/2025 | Summit Interconnect, Inc.Summit Interconnect’s Hollister facility has recently enhanced its quick-turn PCB prototyping capabilities by installing the TiTAN PSR-H Direct Imaging (DI) system.
Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON
04/30/2025 | ElephantechJapanese deep-tech innovator Elephantech has officially launched its SustainaCircuits multilayer solutions, offering both equipment and materials to enable low-carbon Printed Circuits Board (PCB) manufacturing.
Safran Invests in mirSense, a French Startup Pioneering Quantum-cascade Lasers
04/30/2025 | SafranSafran, through its Safran Corporate Ventures investment subsidiary, has invested in mirSense, a French startup specializing in quantum-cascade lasers (QCLs).