-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueMoving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
VJ Electronix to Show Newest Component Counting System and Rework Systems at APEX 2020
January 6, 2020 | VJ ElectronixEstimated reading time: 1 minute

VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, will exhibit in Booth 3627 at the 2020 IPC APEX EXPO in San Diego, CA., Feb. 4−6, 2020. The company will demonstrate the latest enhancements to its XQuik X-ray Component Counter series and its Summit Series Rework product lines.
The VJ Electronix XQIII is the fastest component counter available on the market with 10 seconds per reel count time. The XQIII does not require models, libraries or a connection to the cloud. The system’s automatic algorithms recognize components. The built-in barcode reader eliminates the extra manual scanning step. Unique imaging technology provides the greatest count accuracy.
The XQII and XQuik III are both designed to be used stand alone or with full material handling automation. The built in link to your MES system provides data transfer including reel ID and count, as well as user configurable fields such as operator ID, timestamp, part number, etc. The XQuik III and XQII series counters remain best in class.
The Industry’s leading Summit iSeries Rework products will also be on display. iSeries systems are an improved version of the world’s most popular rework system. VJE has maintained all the benefits of high efficiency convection heating and the renowned 1-2-3-Go interface, coupled with updated technology for greater reliability and an improved price point. Further refinements enhance the system’s performance with ultra-small components like 01005s, while maintaining its capabilities with large boards, oversized CPU sockets, connectors and large BGAs up to 120x120mm.
Suggested Items
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Hon Hai Research Institute Achieves Breakthrough in Quantum Cryptography Recognized by Leading Global Conference
06/17/2025 | FoxconnHon Hai Research Institute (HHRI), the research arm of Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer and technology service provider, has achieved a significant breakthrough in quantum computing.
Marcy's Musings: The Hole Truth—Via Integrity in an HDI World
06/17/2025 | Marcy LaRont -- Column: Marcy's MusingsThis month, we’re talking about “the hole truth,” namely, via reliability in an HDI world. As I contemplated what it takes to get the “perfect” via, it got me thinking about what it takes to create the “perfect” magazine issue.
Adeon Technologies Signs Agreement as Distribution and Service Partner for PMT Global
06/13/2025 | Adeon Technologies BVAdeon Technologies has signed an agreement as Distribution and Service partner with PMT Global from Germany for its high precision measurement range of products.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd