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VJ Electronix to Show Newest Component Counting System and Rework Systems at APEX 2020
January 6, 2020 | VJ ElectronixEstimated reading time: 1 minute

VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, will exhibit in Booth 3627 at the 2020 IPC APEX EXPO in San Diego, CA., Feb. 4−6, 2020. The company will demonstrate the latest enhancements to its XQuik X-ray Component Counter series and its Summit Series Rework product lines.
The VJ Electronix XQIII is the fastest component counter available on the market with 10 seconds per reel count time. The XQIII does not require models, libraries or a connection to the cloud. The system’s automatic algorithms recognize components. The built-in barcode reader eliminates the extra manual scanning step. Unique imaging technology provides the greatest count accuracy.
The XQII and XQuik III are both designed to be used stand alone or with full material handling automation. The built in link to your MES system provides data transfer including reel ID and count, as well as user configurable fields such as operator ID, timestamp, part number, etc. The XQuik III and XQII series counters remain best in class.
The Industry’s leading Summit iSeries Rework products will also be on display. iSeries systems are an improved version of the world’s most popular rework system. VJE has maintained all the benefits of high efficiency convection heating and the renowned 1-2-3-Go interface, coupled with updated technology for greater reliability and an improved price point. Further refinements enhance the system’s performance with ultra-small components like 01005s, while maintaining its capabilities with large boards, oversized CPU sockets, connectors and large BGAs up to 120x120mm.
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Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Nordson Reports Q3 Fiscal 2025 Results and Updates Full Year Guidance
08/21/2025 | BUSINESS WIRENordson Corporation reported results for the fiscal third quarter ended July 31, 2025. Sales were $742 million compared to the prior year’s third quarter sales of $662 million.
Haylo Labs Acquires Plessey Semiconductors
08/20/2025 | Haylo LabsHaylo Labs has acquired Plessey Semiconductors, the UK’s leading innovator in microLED display technology.
SoftBank Group and Intel Corporation Sign $2B Investment Agreement
08/19/2025 | Intel CorporationSoftBank Group Corp. and Intel Corporation today announced their signing of a definitive securities purchase agreement, under which SoftBank will make a $2 billion investment in Intel common stock.
20 Years of Center Nanoelectronic Technologies (CNT) – Backbone of German Semiconductor Research Celebrates Anniversary
08/14/2025 | Fraunhofer IPMSThe Center Nanoelectronic Technologies (CNT) of the Fraunhofer Institute for Photonic Microsystems (IPMS) is celebrating its 20th anniversary this year. Since its founding in 2005, it has developed into a pillar of applied semiconductor research in Germany and Europe. With its unique research cleanroom and equipment adhering to the 300-mm wafer industry standard, CNT is unparalleled in Germany and serves as a central innovation driver for the microelectronics industry.