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CyberOptics to Demo SQ3000 Multi-Function System with Advanced Software at IPC APEX
January 7, 2020 | CyberOptics CorporationEstimated reading time: 1 minute

CyberOptics Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will showcase its SQ3000™ Multi-Function for AOI, SPI and CMM in Booth #3113 at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. Additionally, CyberOptics will demonstrate the latest 3D AOI software with ultra-fast programming capabilities, auto tuning and enhancements that significantly speed setup, simplify the process, reduce training efforts and minimize operator interaction.
The 3D SQ3000 all-in-one system can identify critical defects and measure critical parameters, providing a superior process control solution for effective yield management.
In addition to AOI and SPI applications, highly accurate coordinate measurements can be attained faster than a traditional Coordinate Measurement Machine (CMM) – in seconds, not hours. The world’s first in-line CMM includes an extensive software suite for metrology grade measurements on all critical points.
Powered by proprietary Multi-Reflection Suppression (MRS) sensor technology, the 3D SQ3000 all-in-one system offers an unmatched combination of speed, resolution and accuracy. The MRS sensor meticulously identifies and rejects reflections caused by shiny components making it an ideal technology solution for a wide range of applications with stringent requirements. The Ultra-High Resolution MRS sensor option delivers superior performance ideally suited for socket metrology, microelectronics and other applications where an even greater degree of accuracy and inspection reliability is critical.
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Brent Fischthal - Koh YoungSuggested Items
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Nordson Reports Q3 Fiscal 2025 Results and Updates Full Year Guidance
08/21/2025 | BUSINESS WIRENordson Corporation reported results for the fiscal third quarter ended July 31, 2025. Sales were $742 million compared to the prior year’s third quarter sales of $662 million.
Haylo Labs Acquires Plessey Semiconductors
08/20/2025 | Haylo LabsHaylo Labs has acquired Plessey Semiconductors, the UK’s leading innovator in microLED display technology.
SoftBank Group and Intel Corporation Sign $2B Investment Agreement
08/19/2025 | Intel CorporationSoftBank Group Corp. and Intel Corporation today announced their signing of a definitive securities purchase agreement, under which SoftBank will make a $2 billion investment in Intel common stock.
20 Years of Center Nanoelectronic Technologies (CNT) – Backbone of German Semiconductor Research Celebrates Anniversary
08/14/2025 | Fraunhofer IPMSThe Center Nanoelectronic Technologies (CNT) of the Fraunhofer Institute for Photonic Microsystems (IPMS) is celebrating its 20th anniversary this year. Since its founding in 2005, it has developed into a pillar of applied semiconductor research in Germany and Europe. With its unique research cleanroom and equipment adhering to the 300-mm wafer industry standard, CNT is unparalleled in Germany and serves as a central innovation driver for the microelectronics industry.