LC3 for Bluetooth LE Audio Now Available for Cadence Tensilica HiFi DSPs
January 8, 2020 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that an implementation of the Low Complexity Communications Codec (LC3) that is expected to be compliant with LE Audio, the next generation of Bluetooth audio, is available now for Cadence® Tensilica® HiFi DSPs and has been delivered to a lead customer. LC3 provides higher audio quality at lower bandwidth and affords developers greater flexibility in making tradeoffs between audio quality, power consumption and other features for a more optimal user experience. Cadence licensed reference code from Fraunhofer IIS to enable availability of LC3 in conjunction with the initial LE Audio launch, allowing customers to immediately benefit from the latest enhancements including longer battery life, improved connectivity and multi-user sharing.
“Consumer demand for a wide range of Bluetooth audio-based products from headphones and TWS ear buds to portable speakers continues to explode. We are excited that our contributions to LC3 help deliver higher quality and more robust experiences,“ said Marc Gayer, head of business department in the audio and multimedia division of Fraunhofer IIS. “We worked early on in the development of the codec to ensure that LC3 would run extremely efficiently on the Cadence Tensilica HiFi Audio DSP architecture, which translates to extended battery life for consumers.”
“The fact that the LC3 codec can provide very high-quality audio even at low bitrates makes it a key feature of the upcoming LE Audio standard,” said Mark Powell, executive director of the Bluetooth Special Interest Group (SIG). “We are pleased to see member companies working on implementations of the LC3 codec optimized for various processor architectures.”
“Fraunhofer continues to prove that it is an innovative leader in the world of audio/voice codecs with its critical contributions to the new LC3 standard,” said Gerard Andrews, director of audio/voice IP marketing at Cadence. “By working closely with Fraunhofer throughout the development of this audio codec, we are able to offer a highly optimized, ultra-low power implementation on the HiFi architecture in concert with the announcement of LE Audio. This is an example of how we’re continuing to enhance our best-in-class HiFi technology to deliver performance excellence for our customers’ audio and voice implementations.”
Tensilica HiFi DSPs are the most widely licensed audio/voice/AI speech processors. Part of the broad Cadence IP portfolio, they enable SoC design excellence in support of Cadence’s Intelligent System Design™ strategy. For more information on the Tensilica HiFi DSP family, visit http://ip.cadence.com/ipportfolio/tensilica-ip/audio.
Suggested Items
STARTEAM GLOBAL Unveils Innovative Additive Solder Mask Process
06/02/2025 | STARTEAM GLOBALSTARTEAM GLOBAL, a leading PCB manufacturer, has introduced a revolutionary additive solder mask process at its Flero STARTEAM (FST) factory in Italy, leveraging digital inkjet technology to enhance production efficiency and sustainability.
Elma Electronic Bolsters Quality Management Company-wide with Added AS9100:D and ISO9001:2015 Certifications
06/02/2025 | Elma ElectronicElma Electronic now includes AS9100:D and ISO 9001:2015 certifications at its Horsham, Pa. manufacturing facility, earning the company a multiple site accreditation designation.
Efficiency Unleashed: Breaking Down Lean and Six Sigma
06/02/2025 | Marcy LaRont, PCB007 MagazineAs a child in the late 1970s, I lived in Fremont, California, near the GM automotive manufacturing plant. At the time, GM had a terrible reputation for producing poor quality cars that were dwindling in popularity. I toured the GM plant while in elementary school. Each child received a pair of safety glasses before our group was escorted around the plant with our teacher. I remember seeing the car pieces on the line, and workers using blow torches to assemble the car together.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
JBD Sets a New Benchmark for MicroLED Micro-Display Technology
05/29/2025 | PRNewswireAt this pivotal juncture when near-eye display technologies are rapidly advancing toward large-scale deployment, JBD, through sustained technological innovation, has succeeded in reducing the number of defective pixels in its MicroLED micro-displays from ≤100 to ≤3 per panel.