-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
ASM's DEK TQ Innovative Printing Platform Sets New Standards
January 9, 2020 | ASM Assembly SystemsEstimated reading time: 2 minutes
With its DEK TQ, technology leader ASM presents its latest generation of stencil printers, setting new records for performance and precision. For example, with its outstanding core cycle time of five seconds, the DEK TQ stands for maximum throughput in a footprint of only 1.3 by 1.0 meters. And with its precise linear drives, off-belt printing, new clamping systems and an enhanced printhead it achieves an externally certified wet printing accuracy rating of ±17.5 µm @ 2 Cpk. ASM also managed to minimize the need for operator assists with an average time of 8 hours between them. In addition, the DEK TQ features exceptional investment protection. Thanks to its open interfaces, it can be integrated into the smart SMT factory quickly and easily.
The state-of-the-art DEK TQ stencil printer sets new benchmarks in quality and throughput. Functions like off-belt printing, new clamping systems and an innovative printhead with faster and more accurate squeegee pressure control deliver an externally certified wet printing accuracy rating of ±17.5 µm @ 2 Cpk, making the ASM printing platform the ideal module for 0201 metric components and modern ultra-fine-pitch applications.
Compact and powerful with just one assist per shift
The completely revised and extremely robust machine design has a footprint of only 1.3 by 1.0 meters. Fast, precise linear drives, a new three-stage conveyor and the latest generation of the ASM NuMotion control system with optical fiber wiring reduce the core cycle time to as little as five seconds. With features like these, the DEK TQ sets the new industry benchmark for floorspace performance, making it the ideal platform for high-volume production environments.
The DEK TQ reduces operator assists and related line stops to a minimum: the innovative platform is optionally equipped with an automatic paste dispenser (DEK Automatic Paste Dispenser), paste height control (DEK Paste Height Control), and a newly developed, highly efficient understencil cleaning system with an extra-large fabric roll, easily replaceable cleaning units, and a new fluid dispensing system. As a result, the average time between operator assists has been increased to up to 8 hours.
“The number and duration of assists play a significant role in the total costs of the printing process. With the DEK TQ, we enable electronics manufacturers for the first time to reduce these assists to only one per shift on average. This feature and the machine’s high throughput rating deliver exceptionally high productivity in volume production – all in the smallest possible space and with maximum precision and reliability,” says Jens Katschke, solutions marketing manager at ASM.
Flexible interfaces for the smart integrated factory
The DEK TQ is equally future-oriented and open with regard to its connectivity. To exchange data with other line components or higher-level IT systems, the printing platform features a multitude of standard interfaces such as IPC Hermes 9852, Closed-Loop-to-SPI, ASM OIB, and IPC CFX, making it a perfect fit for ASM’s concept of the integrated smart SMT factory.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.