-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
MIRTEC Achieves Most Successful Year in Company History
January 10, 2020 | MirtecEstimated reading time: 2 minutes

MIRTEC Co. LTD, a leading global supplier of automated optical inspection systems to the Electronics Manufacturing Industry, reports record sales revenue in 2019 for its North American Sales and Service Division. “Not only has 2019 been the most successful year in our corporate history,” stated Brian D’Amico, President of MIRTEC Corp, “it represents the ninth consecutive year of record sales revenue for our division. This is quite an accomplishment and an overwhelming testament to the integrity of our products and that of our personnel. It is truly a pleasure to work with such an outstanding team of engineering, sales and support professionals.”
D’Amico, attributes this impressive growth to record demand for MIRTEC’s MV-6 OMNI In-Line 3D AOI system and MV-3 OMNI Desktop 3D AOI system. Customer demand for these two award winning platforms as well as the equally impressive MS-11e 3D SPI system continues to fuel MIRTEC’s expansion within the highly competitive SMT inspection market.
The MV-6 OMNI combines MIRTEC’s exclusive 15 Mega Pixel CoaXPress Camera technology with their proprietary OMNI-VISION® 3D Digital Tri-Frequency Moiré technology to provide precision inspection of SMT devices on finished PCB assemblies.
The award winning MV-3 OMNI Desktop 3D AOI system is configured with the same hardware and software as MIRTEC’s in-line OMNI-VISION® 3D Inspection Systems providing 100% compatibility across MIRTEC’s entire 3D AOI product line. Without question, the MV-3 OMNI is the most technologically advanced Desktop 3D AOI machine in the world!
MIRTEC’s award winning MS-11E 3D SPI machine is also configured with an exclusive 15MP CoaXPress Vision System, providing enhanced image quality, superior accuracy and incredibly fast inspection rates. The machine uses Dual Projection Shadow Free Moiré Phase Shift Imaging technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. The MS-11e uses the same robust platform as MIRTEC’s MV-6 OMNI Series.
“MIRTEC continues to set new standards within the highly competitive Electronics Inspection industry,” continued D’Amico. “These revolutionary products provide unprecedented 3D inspection performance and the industry’s lowest cost of ownership making them an ideal solution for electronics manufacturing companies of all sizes.
“On behalf of all of us at MIRTEC I want to thank our valued customers for your business confidence and your support. It has been a pleasure helping you reach your production quality objectives. We look forward to contributing to your success in 2020 and beyond!”
About MIRTEC
MIRTEC is a leading global supplier of Automated Optical Inspection Systems to the Electronics Manufacturing Industry. For more information, please contact MIRTEC directly. Phone: 203-881-5559 • Fax: 203-881-3322 • Web: www.mirtec.com.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.