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Marcy’s Musings: A World of Difference

09/17/2026 | Marcy LaRont -- Column: Marcy's Musings
I've spent a good deal of time in Asia over the years, both traveling and living there, so arriving in Thailand for THECA wasn't my first experience stepping into another culture or another way of doing business. Still, there is something about being there—moving through a different city, sitting down with people, listening to their conversations, and watching how they approach familiar challenges—that gets me thinking.

The Marketing Minute: When Everyone Is a Thought Leader, No One Is

09/08/2026 | Brittany Martin -- Column: The Marketing Minute
There is no shortage of expertise in the electronics industry. If you spend just a few minutes talking with someone who has been designing circuit boards, running a manufacturing facility, or troubleshooting assembly lines for 20 or 30 years, you will likely walk away knowing something you didn't know before. Yet, somehow, much of the electronics industry’s marketing fails to highlight that expertise.

Where Will the Next Generation of Great Engineers Come From?

08/26/2026 | Brian Buyea, Remtec
Most young engineers do not grow up dreaming about careers in ceramic substrates or plating processes. It’s not because these careers are uninteresting. In many cases, young people simply do not know they exist. They are excited about AI, robotics, aerospace, autonomous vehicles, space exploration, renewable energy, electric vehicles, medical technology, and advanced computing. What many students do not yet understand is that virtually every one of those technologies depends upon an incredibly sophisticated electronics manufacturing infrastructure.

VeCS HDI Process Technology: Has the Time Come for Broader Adoption?

08/25/2026 | Joan Tourné, NextGin Technology
Packaging technology has always driven the PCB, but today's AI and high-performance computing devices are accelerating that relationship. As compute density, bandwidth, and power requirements increase, package, substrate, and PCB design become more interdependent. Modern AI processors, such as NVIDIA's Blackwell architecture, require thousands of package connections, support multiple stacks of high-bandwidth memory (HBM), and can dissipate as much as 1,000 watts of power or more. These demands are driving new approaches to package substrates, redistribution layers (RDLs), thermal management, and PCB fabrication, where manufacturing itself is becoming a limiting factor.

All Flex Expands Reach Through Flex Interconnect Technologies Acquisition

08/19/2026 | Marcy LaRont, I-Connect007
A strategic partnership between Minnesota-based All Flex Solutions and Flex Interconnect Technologies (FIT) will provide value-added engineering and quick-turn, prototype flexible PCB manufacturing with All Flex’s high-volume flex fabrication. The new alliance offers customers a more comprehensive flex solution and an opportunity to streamline their flex PCB supply chain. All Flex CEO John Fallon discusses the strategic rationale behind the partnership, the benefits of having a “100-year plan,” and how the combined organization is positioning itself for optimum growth.
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