Standard of Excellence: The Human Touch in an Automated World
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
Global Sourcing Spotlight: How to Evaluate Supplier Capabilities Worldwide
North America Premiere for Cogiscan’s TTC Go! Application at IPC APEX EXPO 2020
January 13, 2020 | Cogiscan Inc.Estimated reading time: 1 minute
Cogiscan Inc., the leading Track, Trace and Control (TTC) solutions provider for the electronics manufacturing industry is pleased to announce a faster, more efficient, and error-proof Portable Operator Interface: the new TTC GO!
As part of Cogiscan's ongoing commitment to our industry-leading suite of Material Control and other TTC Applications, we are proud to show TTC Go! for the first time in America at APEX 2020. This new application is a major upgrade to the already widely used Portable Operator Interface. Operators require simple and intuitive tools to run production. This new application is completely redesigned to take full advantage of Android 7+ supported mobile devices.
The new TTC GO! Is Modern, Intuitive & Simple:
• Simplify production tasks with a modern and user-friendly handheld interface with intuitive navigation features
• Leverage flexibility by downloading the free app on any Android supported device
• Upgrade outdated technology that will no longer be
supported by PDA vendors
• Save hardware costs by utilizing modern, reliable, and less
expensive devices that can be easily upgraded
“With the introduction of TTC GO, we break a paradigm in how manufacturing software user interfaces are designed. The context driven interface is very intuitive and easy to use as it guides the user to achieve simple tasks with as little clicks, data entry or scanning steps as possible.” Stated André Corriveau, CTO at Cogiscan. “Built on state-of-the-art technologies, it runs over Windows and Android platforms, including smart phones.”
Cogiscan POI users can download & upgrade for FREE with a valid service contract. Come see the new TTC GO! At IPC APEX EXPO, Booth #1737, February 4 to 6, 2020.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Coherent Announces Agreement to Sell Aerospace and Defense Business to Advent for $400 Million
08/15/2025 | AdventCoherent Corp., a global leader in photonics, today announced that it has entered into a definitive agreement to sell its Aerospace and Defense business to Advent, a leading global private equity investor, for $400 million. Proceeds will be used to reduce debt, which will be immediately accretive to Coherent’s EPS.
Flexible Circuit Technologies to Host Free Flex Heater Webinar
08/18/2025 | Flexible Circuit TechnologiesGlobal Supplier of flexible circuits, flex design services, and assembly/box-build services, Flexible Circuit Technology will host their latest webinar, "Thermal Precision Meets Flexibility: The Technology Behind Heater Circuits" on Tuesday, August 26th, 2025 at 11 AM EDT.
Nordson Corporation Announces Earnings Release and Webcast for Third Quarter Fiscal Year 2025
07/31/2025 | Nordson CorporationNordson Corporation today announced it will release third quarter fiscal year 2025 earnings on August 20, 2025, after the close of the market.
Technica USA Welcomes Bill Dodd of Essemtec to the Bay Area
07/28/2025 | Technica USATechnica USA was pleased to welcome the good news regarding Essemtec’s decision to relocate Bill Dodd, Applications Engineer, from Boston to the Bay Area.
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in