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3 Key Takeaways: Why Advanced Materials Are Shaping the Future of Electronics

11/10/2026 | I-Connect007
The electronics industry is facing a new generation of engineering challenges. AI, advanced packaging, high-performance computing, and compact devices are pushing the limits of traditional design approaches. Engineers face mounting pressure to increase performance, manage rising power densities, and ensure reliability as electronic systems become smaller and more complex. In the companion guide, Engineering What’s Next, Qnity expands on the discussions featured in its six-part On the Line With… Qnity: Engineering What’s Next podcast series.

Built for What’s Next: The End of Flat Thinking

11/05/2026 | Michael Gleason -- Column: Built for What’s Next
Advanced PCB design increasingly brings electrical performance, thermal behavior, mechanical requirements, material selection, and manufacturability into the same conversation. The board sits within a larger physical system, and each decision can influence how that system performs. Looking at those relationships together creates more opportunity to optimize the design as a whole.

I-Connect007 Releases Episode 5 of ‘On the Line With… Qnity: Engineering What’s Next’ Podcast Series

11/04/2026 | I-Connect007
I-Connect007 announces the release of the fifth episode in its six-part podcast series, On the Line With… Qnity: Engineering What’s Next. This latest installment, titled “Engineering Heat Out of High-Power Systems,” examines the increasingly critical role of thermal management in electronics design and how innovative materials are enabling higher performance, greater reliability, and improved safety.

indie Selected for Space-Qualified Satellite Program

11/02/2026 | indie Semiconductor
indie Semiconductor, an automotive solutions innovator, today announced that superluminescent light-emitting diodes (SLEDs) from its photonics portfolio have completed final space qualification testing and have been selected for use in the Copernicus Hyperspectral Imaging Mission for the Environment (CHIME)

Wolfspeed Signs Multiyear SiC Agreement for EVs

10/30/2026 | Wolfspeed
Wolfspeed, Inc., a global leader in silicon carbide technology, announced a multiyear supply agreement for Wolfspeed silicon carbide devices to support BorgWarner’s next-generation 800V silicon carbide-based inverter platform as strategic partner.
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