Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
It’s Only Common Sense: Selling During an Economic Downturn
Marcy’s Musings: Can You Hear the Voices?
Reginald Nocom Joins StratEdge as Process Engineer for Manufacturing Semiconductor Packages and IC Assembly Services
January 14, 2020 | StratEdgeEstimated reading time: Less than a minute
StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announces that Reginald (Regi) Nocom has joined StratEdge as a process engineer. With over 20 years in the microelectronics industry and extensive experience in implementing Six Sigma practices, Nocom is well-positioned to lead StratEdge in the development of new processes for manufacturing semiconductor packages and enhancing StratEdge's IC package assembly services.
"StratEdge moved into new facilities last year for designing and manufacturing high-speed, high-power, DC to 63+ GHz packages, and includes cleanrooms for IC package assembly services," said Tim Going, president and CEO of StratEdge. "With the growth of our Assembly Services Division, we are excited to bring Regi on board to help further improve our manufacturing processes."
Nocom comes to StratEdge from Samtec, where he served as a research and development process engineer. He is certified in Six Sigma Green Belt training, has 5S and RETC semiconductor training, and has developed numerous manufacturing tools and processes.
Share on:
Suggested Items
Navigating Change, Mitigating Risk: We’ve Been Here Before
04/22/2025 | Marcy LaRont, PCB007 MagazineI visited with Tom Edman, president and CEO of TTM Technologies, and chair of the IPC Board of Directors. Tom candidly shares his insights into the implications of changes on the defense sector and the broader electronics manufacturing industry, especially concerning PCB manufacturing. With half of TTM’s business tied to defense, Tom discusses the potential opportunities and challenges arising from government initiatives, tariffs, and supply chain complexities.
ViTrox Marks 25 Years of Innovation with Cutting-Edge Solutions at NEPCON China 2025 in Shanghai
04/18/2025 | ViTrox TechnologiesViTrox, which aims to be the World’s Most Trusted Technology Company, is proud to announce its participation in NEPCON China 2025, taking place from April 22–24, 2025, at Booth #1E45, Shanghai World Expo Exhibition & Convention Centre (SWEECC).
Nortech Positioned to Serve Global Markets Amid Tariff Challenges
04/18/2025 | BUSINESS WIRENortech Systems, a global leader in digital connectivity solutions and data management engineering, is strategically positioned to serve customers in Europe and the Asia Pacific region while effectively mitigating the impact of global tariffs and trade challenges.
Can the Electronics Industry Balance Tariffs With Investment?
04/18/2025 | I-Connect007 Editorial TeamTo better understand the U.S. administration’s recent actions on global trade policies, Barry Matties and Nolan Johnson met with Richard Cappetto, IPC’s senior director of North American government relations, who highlighted both the challenges and opportunities available to U.S. companies in the recent trade activity. This could include increased domestic manufacturing and supply chain diversification.
University of Arizona Pioneering Technical Education Beyond Semiconductors
04/18/2025 | Marcy LaRont, PCB007 MagazineWhile many universities struggle to keep their curriculum up to date with the evolving needs of the electronics industry, the University of Arizona stands head and shoulders above the others. Its Center for Semiconductor Manufacturing incorporates five of the colleges at UA and emphasizes an interdisciplinary approach to prepare students for diverse careers in technology and manufacturing.