-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Ucamco Releases New Gerber Fabrication Documentation Specification
January 15, 2020 | UcamcoEstimated reading time: 1 minute
Ucamco has released a new specification for fabrication documentation in Gerber. The specification defines how to transfer information in a machine-readable manner as part of Gerber fabrication data.
Read the full specification here.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Yamaha Robotics Delivers Complete Surface-mount Line to Astemo UK
04/07/2026 | Yamaha RoboticsYamaha Robotics has supplied its 1 STOP SMART SOLUTION for surface-mount assembly to Astemo UK, Ltd.
Take the Mic: Smart and Flexible SMT Solutions from Essemtec
04/03/2026 | Real Time with... APEX EXPOEssemtec is known for naturally adaptive machines inspired by nature and designed for advanced HDI as well as package substrate manufacturing. Pierre-Jean Cancalon discusses new 2K dispensing and high-speed solder paste jetting technologies, perfect for NPI prototyping and flexible production environments.
MVTec Appoints Rob DeMellier as North America Business Development Manager
03/30/2026 | MVTec Software GmbHMVTec Software GmbH, a leading international manufacturer of machine vision software, announces the appointment of Rob DeMellier as Business Development Manager for North America.
MVTec Presents New MERLIC Version: New Features for Easier Integration and Use of Machine Vision
03/03/2026 | MVTecMVTec Software GmbH, a leading global manufacturer of software for machine vision, announces the release of MERLIC 26.03 on March 26, 2026. In addition to powerful machine vision algorithms, MVTec MERLIC provides users with further support aimed at enabling easier and more efficient use of machine vision as a technology. “
Driving Innovation: Size Matters—Navigating the Challenges of XXL PCB Production
03/02/2026 | Kurt Palmer -- Column: Driving InnovationIn high-end electronics, complexity is often measured in microns. However, when those microns are spread across a massive surface area, the engineering challenge fundamentally changes. Imagine two panels: Both are highly complex, featuring 4-stage build-ups, 2-mil line and space patterns, 2-mil microvias, and through-holes with a demanding 1:30 aspect ratio.