-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Best Technical Papers at IPC APEX EXPO 2020 Selected
January 20, 2020 | IPCEstimated reading time: 2 minutes
The IPC APEX EXPO 2020 best technical conference papers in the domestic and international categories have been selected; the paper authors will receive their awards during the opening keynote session on Tuesday, February 4, 2020.
Taking top honors in the domestic paper category, the winning paper is, “Reliable Nickel-Free Surface Finish Solution for High-Frequency-HDI PCB Applications” by Kunal Shah, Ph.D., LiloTree. Dr. Shah will present his paper at Technical Conference Session 15 (Surface Finishes 1) on Wednesday, February 5.
Honorable mention went to “Comparative Corrosion: Engineered Aqueous Cleaner vs. pH Neutral — Round 1” by David Lober, Kyzen Corporation. His co-author was Mike Bixenman, DBA, Kyzen Corporation. This paper will be presented at Technical Conference Session 25 on Thursday, February 6.
The winning paper in the international paper category is “High-Density PCB Technology Assessment for Space Applications” by Maarten Cauwe, Ph.D., IMEC-Cmst. Dr. Cauwe’s co-authors were Erwin Bosman, ACB NV; Alexia Coulon, Thales Alenia Space; Stan Heltzel, European Space Agency; Chinmay Nawghane, IMEC; Marnix Van De Slyeke, ACB NV; Bart Vandevelde, IMEC; and Joachim Verhegge, ACB. This paper will be presented at Technical Conference Session 7 (High I/O Designs) on Tuesday, February 4.
Honorable mention went to “Optimization of PCB SI Coupon Design that Minimizes Discontinuity through Via-In-Pad Plated Over (VIPPO) Technique” by Juhee Lee, ISU Petasys. His co-authors were Kyeongsoo Kim, Kyungsoo Lee, and Namdong Lee, ISU Petasys. This paper will be presented at Technical Conference Session 27 (PCB Fabrication and Materials) on Thursday, February 6.
The papers were evaluated by the IPC APEX EXPO Technical Program Committee and judged on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing as well as value to the industry.
To register for the IPC APEX EXPO technical conference or for more information on all the activities taking place including standards development committee meetings, professional development courses, the exhibition and more, visit www.IPCAPEXEXPO.org.
About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,800 member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/22/2024 | Andy Shaughnessy, I-Connect007In this week’s roundup, I’m highlighting a variety of articles. We have an interview with Jess Hollenbaugh, a recent graduate working for Polar Instruments. We also have an interview with IPC’s Matt Kelly and Devan Iyer, whose white paper may provide a way forward for companies dealing with complex advanced packages. Our newest columnist Tom Yang describes the U.S. PCB industry from the point of view of a technologist from another country, and Dan Beaulieu has a review of Malcolm Gladwell’s follow-up to The Tipping Point. Finally, we have my review of PCB Carolina, a one-day tabletop show that keeps expanding, much like my waistline after eating their catered food. Enjoy!
Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association
11/22/2024 | SIAThe Semiconductor Industry Association (SIA) today announced Western Digital CEO David Goeckeler has been elected Chair of the SIA Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
Meet Polar's New Product Specialist Jess Hollenbaugh
11/21/2024 | Andy Shaughnessy, I-Connect007At PCB West, I spoke with Jess Hollenbaugh, a recent college graduate who has now joined Polar Instruments. In this interview, she shares her journey from a physics student focused on high-energy astrophysics to her new role at Polar. Her insights provide a glimpse into the dynamic opportunities awaiting those who venture into this evolving industry.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.