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Rehm to Attend IPC APEX EXPO in San Diego
January 20, 2020 | Rehm Thermal SystemsEstimated reading time: 1 minute
Rehm Thermal Systems is starting its 2020 trade fair attendances with APEX EXPO IPC in San Diego, US. As an established manufacturer of reflow soldering systems, as well as drying and coating systems, Rehm has also made a name for itself on the American electronics market, especially in recent decades. At IPC APEX EXPO, which will be held at the San Diego Convention Center, Rehm will present its ProtectoXC dispensing system and CondensoXC vapour phase soldering system. The trade fair will take place from 4th to 6th February 2020, and the Rehm team would be thrilled to see you at stand 707.
With ProtectoXC, Rehm has brought a compact and high-performance coating system to the market, which is primarily suitable for small and medium batch sizes. When developing ProtectoXC, the focus was on ensuring that the system features a modern look and intuitive operation, whilst also providing reliable protection for high-quality circuit boards. At APEX EXPO IPC, we will be presenting ProtectoXC with our ViCON system software. The use of touch operating elements and gestures, the new organisation of menu options and control panels were the key factors in the development of the ViCON software.
CondensoXC impresses users with its optimum process performance. Exact profiling by means of the injection principle and the option of soldering under an inert atmosphere provide optimum soldering results. Void-free soldering can also be carried out easily with the vacuum option, which increases the reliability of assemblies significantly. With a footprint of just 2.3 m², this system is specially designed for small series and is also ideal for prototype production. As a batch system, it can be used flexibly, irrespective of the production environment.
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Global Electronics Association, MIMOS Berhad Sign MoU to Advance Malaysia’s Electronics and Semiconductor Ecosystem
03/31/2026 | Global Electronics AssociationThe Global Electronics Association and MIMOS Berhad recently signed a Memorandum of Understanding (MoU) to collaborate in strengthening Malaysia’s electronics and semiconductor ecosystem, with a focus on advanced electronic packaging (AEP), industry alignment, and global best practices.