The Right Approach: Get Ready for ISO 9001 Version 6
Dan’s Biz Bookshelf: ‘Still Broke: Walmart’s Remarkable Transformation'
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
Shaping the future of 5G: Foxconn and Heraeus sign Memorandum of Understanding
January 21, 2020 | HeraeusEstimated reading time: Less than a minute
Foxconn Technology Group and Heraeus, two leading global technology groups, signed a Memorandum of Understanding for a strategic cooperation. Both companies are committed to shaping the future of 5G technology together.
Foxconn and Heraeus aim to jointly develop new market potential in the field of 5G telecommunications and collaborate to test solutions in order to accelerate the development process. A first area of cooperation will be the shielding of electromagnetic interference (EMI)—a key technology for 5G mobile phones.
“Foxconn and Heraeus share the same vision of bettering people’s lives with advancement and application of technologies,” said Max Chu, Chief Procurement Officer at Foxconn. “We aim to leverage each company’s expertise, innovative ability and constant striving for improvement.”
“With 5G technology we are entering a new era of connectivity,” said Frank Stietz, President of Business Area Electronics at Heraeus. “Strong partnerships like this will help us to jointly develop innovative solutions needed by manufacturers in the upcoming years.”
Prior to the signing of the Memorandum of Understanding, Foxconn and Heraeus have cooperated in jointly exhibiting selected technologies at China International Import Exhibition (CIIE) in Shanghai, China this year.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
DARPA, State of New Mexico Establish Framework to Advance Quantum Computing
09/08/2025 | DARPAAs part of the Quantum Benchmarking Initiative (QBI), DARPA signed an agreement with the State of New Mexico’s Economic Development Department to create the Quantum Frontier Project.
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.