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Follow the Story: AI Reshapes the Electronics Supply Chain

09/09/2026 | Michelle Te, I-Connect007
The AI infrastructure boom is creating enormous opportunities for electronics manufacturers, but its effects are spreading well beyond companies building AI servers and data centers. High performance laminates, glass fabric, copper, memory, MLCCs, foundry capacity, and other critical resources are being pulled toward fast-growing AI applications, tightening supplies and pushing up costs elsewhere in the electronics industry. I-Connect007 has been following these developments from several directions. What initially looked like separate stories about laminate availability, memory prices, component demand, PCB capacity, and data-center growth are demonstrating how AI is changing how the electronics supply chain allocates materials, capacity, and investment.

Zhen Ding Technology Reports August 2026 Monthly Revenue

09/08/2026 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported August 2026 revenue of NT$20,666 million, up 41.05% YoY and 17.42% MoM, again setting a record high for the same period in the company’s history.

Radbon Electronics Achieves IPC/WHMA-A-620 QML Validation, Joins IPC Global Qualified Manufacturers List

08/31/2026 | Global Electronics Association
Radbon Electronics Co., Ltd. (Radbon Electronics) has passed the IPC/WHMA-A-620 Qualified Manufacturers List (QML) validation by the Global Electronics Association, earning its place on the IPC Global Qualified Manufacturers List.

GigaDevice Expands EMEA and Southeast Asia Reach with Rutronik Partnership

08/31/2026 | BUSINESS WIRE
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Indium to Showcase High-Reliability Power Device Packaging Solutions at PCIM Asia 2026

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As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability products that are “Electrifying the Future” at PCIM Asia 2026, August 26-28, in Shenzhen, China.
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