Indium Corporation Experts to Present at IPC APEX EXPO

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Several Indium Corporation technical experts will share their knowledge at the IPC APEX Expo, Feb. 1-6, in San Diego, Calif., USA.

The following technical papers from Indium Corporation experts will be featured:

• "Novel TIM Solution with Chain Network Solder Composite" by Dr. Ning-Cheng Lee, Vice President of Technology
• "Enhanced Cleanability Using Fluxes with Decreased Viscosity After Reflow" by Dr. Lee
• "Can a PCBA with a Modern No-Clean Solder Paste Flux Residue Offer Electrical Reliability Comparable to a Cleaned PCBA?" by Kim Flanagan, Technical Support Engineer
• "Optimizing the Robotic Soldering Process" by Robert McKerrow, Product Specialist

Additionally, Claire Hotvedt, Product Development Specialist, will present her poster, "Durafuse™ LT–A Mixed Alloy Solution for Low-Temperature Drop Shock."

Miloš Lazić, Technical Support Engineer, will moderate the technical conference session S05: Advances in Dispensing.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.