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Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
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Saki Selects Jeff Mogensen as General Manager of SAKI America
January 27, 2020 | Saki CorporationEstimated reading time: Less than a minute
Saki Corporation, an innovator in the field of automated optical and X-ray inspection and measurement equipment, announces the selection of Jeff Mogensen to the position of general manager of SAKI America, Inc. Mogensen will be responsible for all sales, R&D, application support, service, and operations for Saki's 3D solder paste inspection (SPI), automated optical inspection (AOI), and automated X-ray inspection (AXI) equipment, software, M2M communication initiatives, and relationships throughout the Americas. Mogensen has 39 years of electronics industry experience in various roles, including key account manager, vice president of sales, and general manager, for companies manufacturing inspection and placement equipment.
"We are excited that Jeff has joined our team at this time of growth and expansion in the Americas," said Norihiro Koike, president of Saki Corporation. "Jeff has built successful teams serving customers across multiple segments both locally and globally. We look forward to having Jeff lead our efforts to support customers in meeting their manufacturing goals and challenges. Please stop by our booth, #2025, at IPC APEX 2020, being held at the San Diego Convention Center in San Diego, CA from February 4-6, to talk to Jeff about your inspection needs."
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Brent Fischthal - Koh YoungSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.