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Saki Selects Jeff Mogensen as General Manager of SAKI America
January 27, 2020 | Saki CorporationEstimated reading time: Less than a minute
Saki Corporation, an innovator in the field of automated optical and X-ray inspection and measurement equipment, announces the selection of Jeff Mogensen to the position of general manager of SAKI America, Inc. Mogensen will be responsible for all sales, R&D, application support, service, and operations for Saki's 3D solder paste inspection (SPI), automated optical inspection (AOI), and automated X-ray inspection (AXI) equipment, software, M2M communication initiatives, and relationships throughout the Americas. Mogensen has 39 years of electronics industry experience in various roles, including key account manager, vice president of sales, and general manager, for companies manufacturing inspection and placement equipment.
"We are excited that Jeff has joined our team at this time of growth and expansion in the Americas," said Norihiro Koike, president of Saki Corporation. "Jeff has built successful teams serving customers across multiple segments both locally and globally. We look forward to having Jeff lead our efforts to support customers in meeting their manufacturing goals and challenges. Please stop by our booth, #2025, at IPC APEX 2020, being held at the San Diego Convention Center in San Diego, CA from February 4-6, to talk to Jeff about your inspection needs."
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.