Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Saki America Demonstrates New Inspection Systems and Software at IPC APEX EXPO 2020
January 29, 2020 | Saki CorporationEstimated reading time: 2 minutes
Saki Corporation, an innovator in the field of automated optical and X-ray inspection and measurement equipment, will demonstrate new automated inspection products, software, and capabilities and announce new personnel, offices, and collaborations at IPC APEX EXPO, San Diego, CA. On display will be a new combination 3D automated optical inspection (AOI) with 3D solder paste inspection (SPI) system, an automated X-ray inspection (AXI) system for printed circuit board assemblies (PCBAs), new self-programming software with self-tuning, and advanced M2M capabilities.
Saki's combination AOI/SPI system fits NPI, high-mix/low-volume, and high-volume applications, enabling all companies to use both SPI and AOI inspection to ensure the quality of their manufacturing process and products, even when using 01005 and 0201 metric components and board sizes up to 27" x 34". Multiple sensors of 7μm, 12μm, and 18μm accommodate the inspection needs of almost all manufacturing operations. Common software and a common user interface enable Saki's SPI, AOI, and AXI results to be viewed together, and programming is easy and intuitive, taking minutes instead of hours and providing automated data analytics and line performance dashboards.
Saki's 3Xi-M110 3D-CT AXI machine for printed circuit board assemblies ensures the quality of hidden solder joints for bottom-electrode packages such as BGAs, LGAs, QFNs, flip-chip, and package-on-package and provides precise volumetric measurements and shape reconstruction to find voids, head-in-pillow, and other defects that are difficult to identify. The new X-ray tube reduces X-ray exposure up to 70% by powering the X-rays on only at the moment of image capture. The tube doesn't need periodic maintenance or spare parts and the system reports when the tube needs replacing. Saki's new system delivers high-resolution from 10μm to 30μm. The 3Xi-M110 is 40% lighter and 25% smaller, saving floorspace. Image capture speed is increased by 30%, reducing production-line takt time.
Saki's new software solutions include its QD Analyzer which it co-developed with Cogiscan. This advanced software for manufacturing production quality and control presents actionable KPI data to accurately identify the cause of defects based on inspection results, while simultaneously monitoring machine performance and collecting traceability data. The software includes a defect-analysis dashboard detailing line performance, including drilling down to the exact pin of a reference designator to discover exactly what's hindering productivity.
"IPC APEX EXPO will be a chance to introduce Saki America's new personnel and offices," said Norihiro Koike, president of Saki Corporation. "Saki technical experts from Mexico, Brazil, and Japan, as well as the United States, will be available to assist with your inspection needs. Please visit our booth #2025 at IPC APEX EXPO 2020, being held at the San Diego Convention Center in San Diego, CA from February 4−6."
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.