-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Saki America Demonstrates New Inspection Systems and Software at IPC APEX EXPO 2020
January 29, 2020 | Saki CorporationEstimated reading time: 2 minutes
Saki Corporation, an innovator in the field of automated optical and X-ray inspection and measurement equipment, will demonstrate new automated inspection products, software, and capabilities and announce new personnel, offices, and collaborations at IPC APEX EXPO, San Diego, CA. On display will be a new combination 3D automated optical inspection (AOI) with 3D solder paste inspection (SPI) system, an automated X-ray inspection (AXI) system for printed circuit board assemblies (PCBAs), new self-programming software with self-tuning, and advanced M2M capabilities.
Saki's combination AOI/SPI system fits NPI, high-mix/low-volume, and high-volume applications, enabling all companies to use both SPI and AOI inspection to ensure the quality of their manufacturing process and products, even when using 01005 and 0201 metric components and board sizes up to 27" x 34". Multiple sensors of 7μm, 12μm, and 18μm accommodate the inspection needs of almost all manufacturing operations. Common software and a common user interface enable Saki's SPI, AOI, and AXI results to be viewed together, and programming is easy and intuitive, taking minutes instead of hours and providing automated data analytics and line performance dashboards.
Saki's 3Xi-M110 3D-CT AXI machine for printed circuit board assemblies ensures the quality of hidden solder joints for bottom-electrode packages such as BGAs, LGAs, QFNs, flip-chip, and package-on-package and provides precise volumetric measurements and shape reconstruction to find voids, head-in-pillow, and other defects that are difficult to identify. The new X-ray tube reduces X-ray exposure up to 70% by powering the X-rays on only at the moment of image capture. The tube doesn't need periodic maintenance or spare parts and the system reports when the tube needs replacing. Saki's new system delivers high-resolution from 10μm to 30μm. The 3Xi-M110 is 40% lighter and 25% smaller, saving floorspace. Image capture speed is increased by 30%, reducing production-line takt time.
Saki's new software solutions include its QD Analyzer which it co-developed with Cogiscan. This advanced software for manufacturing production quality and control presents actionable KPI data to accurately identify the cause of defects based on inspection results, while simultaneously monitoring machine performance and collecting traceability data. The software includes a defect-analysis dashboard detailing line performance, including drilling down to the exact pin of a reference designator to discover exactly what's hindering productivity.
"IPC APEX EXPO will be a chance to introduce Saki America's new personnel and offices," said Norihiro Koike, president of Saki Corporation. "Saki technical experts from Mexico, Brazil, and Japan, as well as the United States, will be available to assist with your inspection needs. Please visit our booth #2025 at IPC APEX EXPO 2020, being held at the San Diego Convention Center in San Diego, CA from February 4−6."
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.