Lenthor Engineering Announces Year End 2019 Financial Results
February 3, 2020 | Lenthor EngineeringEstimated reading time: Less than a minute
Lenthor Engineering, Inc., a California based designer, manufacturer and assembler of rigid-flex and flex printed circuit boards, announces its 2019 year-end financial results.
Strong performance was reported for Q4 2019 with revenue totaling $9.2M compared to Q4 2018 revenues of $7.8M representing a 18.5% increase. Total revenue for the full calendar year 2019 reported in at $35.1M compared to $27.5M in 2018 an impressive 21.7% increase. With these results Lenthor Engineering retains its positon as one of the largest privately owned flex and rigid-flex fabrication and assembly companies in North America.
Profit totals for both Q4 2019 and full calendar year 2019 also reported in as exceptional resulting in a significant year over year increase. The increase in profitability can be attributed to the previous year’s capitalization expenditures coming on-line during 2019.
Lenthor Engineering continues funding of its business expansion plans with capital expenditures in 2020 planned for $2.5M. This level of expenditure is due to forecasted growth in Lenthor’s Mil/Aero, Telecomm and Medical market segments along with a rebounding Semiconductor Equipment Manufacturing segment.
Suggested Items
Stephen Winchell Appointed DARPA Director
06/02/2025 | DARPAStephen Winchell was sworn in today as the 24th director of the Defense Advanced Research Projects Agency.
Uyemura Expands Engineering Team in Great Lakes Region
05/30/2025 | UyemuraAndrew Jin has joined Uyemura’s Engineering Team as Technical Service Engineer for the Midwest. Jin was formerly with Sensient Technologies, Flavors and Extracts Division, where his focus was CO2 emissions and water quality; he also did capital project work with production equipment.
Defining the Ideal PCB Design Data Output
05/27/2025 | Stephen V. Chavez, Siemens EDAAt the heart of delivering successful, manufacturable printed circuit boards lies a vital question: What should your design data output package include to best support manufacturing? The answer: It depends. There are many factors to consider regarding the specific category you’re designing for—such as mil/aero, space, medical, and commercial. Other factors that need to be considered are requirements and engineering intent.
Renesas Partners with Indian Government to Drive Innovation
05/14/2025 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced its partnership with the Ministry of Electronics & Information Technology (MeitY), Government of India, to support local startups and academic institutions in the field of VLSI and embedded semiconductor systems.
The Test Connection Inc. Appoints USM Reps as Exclusive Sales Representative in Mexico
05/13/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce the appointment of USM Reps as its exclusive sales representative in Mexico.