Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
It’s Only Common Sense: Your Biggest Competitor Is Complacency
The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
Machine Vision Products Introduces Versa AOI/SPI Solution
February 3, 2020 | Machine Vision ProductsEstimated reading time: 1 minute
Building on MVP’s 25 years’ experience of innovative Automated Optical Inspection the Versa system brings the latest 3D technologies to MVPs SMT and SPI offerings and is a significant advance in the flexibility of PCB assembly inspection.
Uniquely, MVP’s Versa system allows fast programming and the flexibility to fit into all the processes in the line: Paste Inspection, Pre-Reflow, Post-Reflow, Post-Wave and Selective Solder.
The Versa system, is the first introduction in a new series of MVP 3D AOI products distinguished by: high-performance defect detection, lowest over-rejection and a low cost of ownership. With the enhanced 3D capabilities, the Versa maintains MVP’s flagship process flexibility and scalability.
Cultivating on our expertise in defect detection for SMT and microelectronics inspection, MVP’s Versa allows for versatile program strategies in a single software toolset.
Using MVP’s ease-of-use ePro software guides you through the program generation process allowing for each inspection strategy to be developed quickly and automatically.
Import capabilities include Gerber, ODB++ and a variety of other formats. Combined with MVP’s leading-edge optimization tools for high performance and minimized over rejection, ease-of-use and rapid programming has been a paramount objective for our latest software suite.
Designed with future technology trends in mind, Versa’s 3D and optical capabilities provide high accuracy measurement capabilities for all current and future paste and SMT inspection. The Versa has multiple 3D options for even the most complex of inspection challenges
Using standard software and hardware across the Versa’s cross-process capability allows you to reduced support costs as you only need to provide support and training for a single platform vs. multiple different system. MVP’s leading reliability allows you to obtain the highest performance and uptime from your investments.
Visit MVP at IPC Apex 2020 at booth 1800 to see and have a demonstration of our latest SMT and Microelectronics Inspection Solutions.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.