Dan’s Biz Bookshelf: Four Important Books You Need to Read (Not Just Say You Have)
The Marketing Minute: Cracking the Code of Technical Marketing
Machine Vision Products Introduces Versa AOI/SPI Solution
February 3, 2020 | Machine Vision ProductsEstimated reading time: 1 minute
Building on MVP’s 25 years’ experience of innovative Automated Optical Inspection the Versa system brings the latest 3D technologies to MVPs SMT and SPI offerings and is a significant advance in the flexibility of PCB assembly inspection.
Uniquely, MVP’s Versa system allows fast programming and the flexibility to fit into all the processes in the line: Paste Inspection, Pre-Reflow, Post-Reflow, Post-Wave and Selective Solder.
The Versa system, is the first introduction in a new series of MVP 3D AOI products distinguished by: high-performance defect detection, lowest over-rejection and a low cost of ownership. With the enhanced 3D capabilities, the Versa maintains MVP’s flagship process flexibility and scalability.
Cultivating on our expertise in defect detection for SMT and microelectronics inspection, MVP’s Versa allows for versatile program strategies in a single software toolset.
Using MVP’s ease-of-use ePro software guides you through the program generation process allowing for each inspection strategy to be developed quickly and automatically.
Import capabilities include Gerber, ODB++ and a variety of other formats. Combined with MVP’s leading-edge optimization tools for high performance and minimized over rejection, ease-of-use and rapid programming has been a paramount objective for our latest software suite.
Designed with future technology trends in mind, Versa’s 3D and optical capabilities provide high accuracy measurement capabilities for all current and future paste and SMT inspection. The Versa has multiple 3D options for even the most complex of inspection challenges
Using standard software and hardware across the Versa’s cross-process capability allows you to reduced support costs as you only need to provide support and training for a single platform vs. multiple different system. MVP’s leading reliability allows you to obtain the highest performance and uptime from your investments.
Visit MVP at IPC Apex 2020 at booth 1800 to see and have a demonstration of our latest SMT and Microelectronics Inspection Solutions.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.