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Nihon Superior Wins Innovation Award for New Flux-Cored Solder Wire
February 4, 2020 | Nihon Superior Co. Ltd.Estimated reading time: 1 minute
Nihon Superior Co. Ltd., an advanced joining material supplier, was awarded an IPC APEX EXPO 2020 Innovation Award on Tuesday, Feb. 4, 2020 during the opening keynote.
A panel of industry experts rated and scored each product and assigned a numerical value to each submitted product based on the following criteria: How is this product innovative? How is this product changing the manufacturing industry? What value will customers experience with this new product?
When a solder joint is made with a soldering iron, the tin reacts with the iron plating on the tip, gradually eroding it. Eventually the underlaying copper is exposed resulting in damage to the tip. TipSave N slows this erosion, extending the tip life by 3X and reducing the replacement cost of soldering tips.
Paired with the (032) no-clean, halogen-free cored-flux, it provides fast wetting and low spattering. TipSave N is a good match for hand soldering as well as continuous robotic soldering as it reduces required soldering tip change overs, increasing production while reducing cost.
The IPC APEX EXPO Innovation Awards celebration of the innovators and forward thinkers who are changing the technological landscape of the electronics industry.
Nihon Superior continues to offer solutions to the challenges facing the electronics industry, such as improvements in reliability, thermally stable joining, and lead-free die attach. For more information about Nihon Superior’s new flux-cored wire, solder pastes and lead-free products, visit us at booth #2043 or at www.nihonsuperior.co.jp/english.
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Brent Fischthal - Koh YoungSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.