iNEMI End-of-Project Webinar: New Packaging Technology Qualification Methodology Project
February 5, 2020 | iNEMIEstimated reading time: Less than a minute
Current package qualification methods are based on past test methods that do not always consider newer use conditions and applications. iNEMI’s New Packaging Technology Qualification Methodology project has focused on identifying and developing a robust methodology for qualifying new packaging technologies for a broad range of applications. The project team reviewed current industry standards to understand the purpose, scope and test conditions/requirements, then conducted two industry surveys to understand the current qualification methodology, identify concerns in use, and identify and analyze gaps.
This webinar will review the gaps identified in current test methods and qualification standards for new advanced packaging, present recommendations for package qualification methodologies for new technologies and materials, and discuss next steps.
Registration
These webinars are open to industry (iNEMI membership is not required). Click on the links below to register. For additional information, please contact Masahiro Tsuriya (m.tsuriya@inemi.org).
Session 1 (APAC)
February 19, 2020
10:00 a.m. JST (Japan)
9:00 a.m. CST (China)
8:00 p.m. EST (U.S.) on Feb. 18
5:00 p.m. PST (U.S.) on Feb. 18
Session 2 (Americas and EMEA)
February 19, 2020
10:00 a.m. EST (U.S.)
7:00 a.m. PST (U.S.)
4:00 p.m. CET (Europe)
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
MES Software Tools Need Thoughtful Integration
10/21/2025 | Nolan Johnson, SMT007 MagazineThe Global Electronics Association recently published a survey report on the state of EMS production software. This project, led by Thiago Guimaraes, director of industry intelligence, connects the dots across the global electronics value chain to uncover practical insights that individual companies might not have seen on their own. In this interview, Thiago discusses the whys and hows of this report.
SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
Technica USA Named Exclusive U.S. Distributor for DCT Cleaning Products
10/14/2025 | Technica USATechnica USA is pleased to announce a strategic partnership with DCT USA, LLC, becoming the exclusive master distributor of DCT cleaning products in the United States, effective November 1, 2025.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.