It’s Only Common Sense: Customers Capabilities—and Confidence
Marcy’s Musings: Operating Without a Rulebook
Dan’s Biz Bookshelf: ‘The 'NVIDIA Way: Jensen Huang and the Making of a Tech Giant’
Cyient Inaugurates Wire Harness Lab for Production and Prototyping in its Peoria Office
February 17, 2020 | CyientEstimated reading time: 1 minute
Cyient, a global engineering and technology solutions company, today announced that it has opened a wire harness facility in its office in Peoria Heights, Illinois. The facility complements the company's design, build, and maintain approach, and adds capabilities to support customers in harness prototyping by increasing design process speed and iterative development for electrical systems.
The 1,100 sq ft, restricted-access lab is equipped with pneumatic crimping tools, including an ultrasonic splicer and braider, to facilitate quality production and prototypes for electrical wire harnesses. Harness rework, testing, field installation, and troubleshooting are additional services that Cyient will offer from the new facility. While the facility has been launched with a single, nine-hour shift, the company will expand operations for 24/7 support in the future.
Demonstrating its continued commitment to quality and safety, Cyient is working toward the Wiring Harness Manufacturer's Association Certification, bringing extended value to its prototyping capability. The company's move to add this facility provides customers in North America ready access to time-sensitive wire harness prototype products and field support.
Commenting on the capability, Gordon Hilbun, Head of Cyient's Industrial Business, said, "This is a critical addition to our portfolio and will help us offer full product life cycle support to our customers, especially for time-critical new product introduction requirements. Our new wire harness lab strengthens our electronics and electrical solution offering, addressing the demand for end-to-end support."
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
FlashPCB Names Matthew Belknap Production Manager as Operations Continue to Ramp
04/21/2026 | FlashPCBFlashPCB, a leading provider of quick-turn PCB assembly, has promoted Matthew Belknap to Production Manager, following his recent start with the company earlier this year.
FlashPCB Welcomes Adam Broeckert, EIT as Manufacturing Engineer
04/20/2026 | FlashPCBFlashPCB, a leading provider of quick-turn PCB assembly, is pleased to announce the addition of Adam Broeckert, EIT, as Manufacturing Engineer.
Single Pair Ethernet (SPE): A Valuable Option for Modern Designs
04/20/2026 | Marcy LaRont, I-Connect007When it comes to designing PCBs and full systems for increasingly complex electronics hardware, who doesn’t want to reduce complexity and cost? Single-Pair Ethernet (SPE) has emerged as a solution and is gaining rapid attention across industrial electronics and PCB design because it enables Ethernet communication over a single twisted pair, replacing the traditional two- or four-pair cabling used in standard Ethernet networks. This seemingly simple shift has significant implications for designers: smaller connectors, reduced cable weight, longer reach, and the ability to carry both data and power over a single pair.
DARPA Launches HARQ Program to Integrate Diverse Qubits for Scalable Quantum Computing
04/20/2026 | DARPADARPA has launched the Heterogeneous Architectures for Quantum (HARQ) program, an effort aimed at overcoming one of the most persistent barriers in quantum computing: how to move beyond single-technology systems to achieve and scale practical, high-impact applications.