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Flexible Printed Circuit Boards Market—2026: Industry Growth, Opportunities, Applications, Trends and Revenue Strategies
February 18, 2020 | Allied Market ResearchEstimated reading time: 1 minute
FPCBs are widely used across applications such as LCD display, mobile screen, connectivity antennas, and flexible circuitry used in rechargeable batteries. Growth in demand for consumer electronic goods, increase in popularity of Internet of Things (IoT), and adoption of FPCBs in automotive applications drive the market growth.
Moreover, increase in demand for automated robots is expected to provide lucrative opportunities to market players. Multilayer FPCBs led the FPCBs market, and is expected to maintain this trend throughout the forecast period. However, the rigid-flex FPCBs segment is expected to witness significant growth in the future, owing to the compact size and low power consumption.
The global market is expected to garner $27 billion by 2022,growing at a CAGR of 10.4% from 2016-2022.
Asia-Pacific dominated the global market, in terms of revenue, accounting for more than 46% in 2015, followed by North America.
Among end user, consumer electronics dominated the global market in 2015, accounting for about 30% share. However, automotive electronics is expected to grow at the highest CAGR of 10.7%, owing to increase in demand for durable devices with enhanced efficiency.
Asia-Pacific was the major revenue contributor in 2015, and is expected to maintain its dominance in the future, owing to increase in number of electronic applications. Moreover, developments in consumer electronics and industrial systems are expected to boost the FPCBs market growth, especially in the Asian countries, such as China, Japan, Oceania, and India.
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LAMEA is projected to grow at the highest CAGR during the analysis period, owing to increase in portable appliances and rise in the adoption of FPCBs in automotive applications. Moreover, technological advancements to overcome power loss issues in extreme conditions are projected to offer lucrative opportunities for market players in the near future.
The key players operating in the FPCB market have adopted new product launch as their preferred strategy to expand their market foothold. The major players profiled in this report include NOK Corporation (Nippon Mektron Ltd.), Sumitomo Electric Industries, Ltd. (SEI), Fujikura Ltd., Multi-Fineline Electronix, Inc., Zhen Ding Technology Holding Limited (ZDT), Nitto Denko Corp., Interflex Co., Ltd., Career Technology, FLEXium Interconnect, Inc., and ICHIA Technologies Inc.
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Rachael Temple - AlltematedSuggested Items
Global TV Shipments Remain Flat at 61.5 Million in 4Q25 Despite 25% Decline in China
03/04/2026 | BUSINESS WIREGlobal TV shipments remained flat year-on-year at 61.5 million units in 4Q25, despite a sharp decline in China, according to data from Omdia’s latest TV Sets (Emerging Technologies) Market Tracker: History – 4Q25. Shipments in China fell by 25.3% year-on-year, as government subsidies ended and many consumers brought forward upgrades over the past year.
It’s Only Common Sense: Reinvention Is a Fundamental Leadership Responsibility
03/02/2026 | Dan Beaulieu -- Column: It's Only Common SenseIf you’re waiting until the numbers drop, the customers leave, or your competitors catch up before you reinvent your business practices, you’ve already lost. Reinvention is a fundamental leadership responsibility, and successful companies reinvent themselves before they have to. They see it not as a rescue mission, but as a rhythm: questioning, disrupting, and rebuilding before market forces force their hand. Leaders who change only when cornered are followers pretending to lead.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
02/13/2026 | Michelle Te, I-Connect007This week, I’ve taken some extra time to better learn some video and photo editing software programs we use at I-Connect007. You’ll want to check out my LinkedIn video to see how I brought my avatar to life for this week’s must-reads! The items I’m highlighting this week are also about learning something new, from Pete Starkey’s thorough three-day review of the EIPC Winter Conference in Aix-en-Provence, France, to what’s on the horizon for advanced electronics packaging. I also share details about the new Design Village at APEX EXPO 2026, preview a new column from Remtec’s Chandra Gupta, and discuss why marketing isn’t a one-and-done deal.
EIPC Winter Conference 2026 Review: The Keynote Sessions
02/11/2026 | Pete Starkey, I-Connect007Aix-en-Provence (pronounced “ex-ahn-pro-vonse”), a historic city and commune in the south of France, about 20 miles north of Marseille, was the pleasant venue for EIPC’s Winter Conference in early February. Industry delegates from 11 European countries, as well as from the U.S. and China, gathered at the Renaissance Hotel for a two-day programme, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” An added attraction was a privileged visit to the ITER fusion power project at the Cadarache research and development centre.
Survey Says: Avnet's Insights Into How Engineers Are Adopting AI
02/09/2026 | Nolan Johnson, I-Connect007Avnet regularly surveys engineers to learn what they’re thinking. That sort of information is quite important to Alex Iuorio, vice president of supplier development at Avnet. In this interview, Alex talks about what he’s learned from the most recent survey and its implications to the supply market in 2026 and beyond. No surprise, AI plays a remarkably large role in all the current trends.