Chromasens Sharpens Accuracy of 3D Machine Vision Imaging with New Reconstruction Algorithm
February 24, 2020 | ChromasensEstimated reading time: 1 minute

Chromasens, a global leader in linescan machine vision technology, today introduced an advanced 3D reconstruction method to its CS-3D-API (Application Programming Interface) library that empowers integrators to build, deploy, and scale higher value 3D imaging systems capable of improved detection of extremely small defects. Based on the semi-global matching algorithm (SGM), it combines global and local stereo methods for more accurate, pixel-wise matching at low runtime.
Chromasens 3D stereo linescan cameras have been unlocking new insights far beyond the capabilities of standard 2D cameras for over a decade, especially in sectors such as semiconductors and automotive sectors. By measuring the precise location, shape, volume, surface angles and degrees of flatness of objects under inspection at extremely high resolutions, Chromasens 3D cameras ensure manufacturers of defect-free products ranging from ball bearings to fresh fruit.
The new SGM algorithm represents an alternative to the traditional Block Matching (BM) method used previously with Chromasens 3D stereo cameras to match corresponding pixels between two images. The primary difference between the two methods is how a matching cost (energy) is computed. For BM, the cost is computed with normalized cross-correlation, while SGM utilizes a specialized Census transformation. As a result, prior knowledge about a surface structure can be incorporated, making the SGM algorithm more accurate in generating 3D point clouds that better identify object borders, and reconstruct fine structures and weakly textured terrain, without artifacts.
Suggested Items
New High Power 3D AXI for Power Electronics from Test Research, Inc.
04/17/2025 | TRITest Research, Inc. (TRI), a leading provider of Test and Inspection solutions for the electronics manufacturing industry, proudly announces the launch of the 3D AXI TR7600HP system. Designed for power semiconductor inspection, the TR7600HP enhances accuracy and efficiency in detecting defects in components such as IGBTs, MOSFETs, SiC inverters, and Paladin Connectors.
Real Time with... IPC APEX EXPO 2025: MivaTek is Revolutionizing Circuit Board Manufacturing with DART Technology
04/02/2025 | Real Time with...IPC APEX EXPOBrendan Hogan from MivaTek Global discusses the company's focus on direct imaging for circuit boards and semiconductors. MivaTek is introducing DART technology for dynamic feature size adjustments. This technology enhances precision, improving registration and throughput.
Real Time with... IPC APEX EXPO 2025: Schmoll America—Committed to Supporting Customers
03/31/2025 | Real Time with...IPC APEX EXPOKurt Palmer of Schmoll America and Stephan Kunz of Schmoll Maschinen GmbH had a great show, reporting solid attendance and good opportunities, as Schmoll America celebrates its first anniversary. With a booth full of equipment for attendees to see and touch, they showcased unique products like the Pico laser and X-ray machine, and discussed plans for a new facility.
Technica USA and CBT Introducing TiTAN Hybrid at IPC APEX EXPO 2025
03/18/2025 | Technica USAThe wait is over! Technica and CBT are proud to unveil TiTAN Hybrid, a groundbreaking innovation set to redefine the PCB industry. Designed for unmatched performance, efficiency, and adaptability, this cutting-edge laser imaging technology brings the future to you—today.
Teledyne Delivers 100th Infrared Detector for the Space Development Agency's Tracking Layer
03/06/2025 | TeledyneTeledyne Technologies Incorporated, a leading provider of advanced imaging solutions, is proud to announce its continuing pattern of on-time and early deliveries for the Space Development Agency's (SDA) proliferated constellation.