Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
TTM Technologies, Inc. Opens Advanced Technology Center in Chippewa Falls, Wisconsin
February 26, 2020 | TTM Technologies, Inc.Estimated reading time: 1 minute
TTM Technologies, Inc., a leading global printed circuit board (PCB) manufacturer, focusing on quick-turn and volume production of technologically complex PCBs, backplane assemblies and electro-mechanical solutions, as well as a global designer and manufacturer of high-frequency radio frequency (RF) and microwave components and assemblies, has announced the opening of a new, North American, advanced technology center in Chippewa Falls, Wisconsin.
The grand opening ceremony took place on February 18, 2020, and included customers, suppliers, local government officials and the many TTM individuals from across North America that helped make this significant event possible.
This revitalized 40,000 sq. ft. facility, located at 850 Technology Way, offers a wide variety of some of the most advanced PCB manufacturing solutions offered in North America today, including the ability to manufacture substrate-like PCBs. TTM acquired the assets of i3 Electronics, Inc. (i3) in June, 2019, and shortly thereafter began work to quickly retool this facility which started production in January, 2020. The new state-of-the-art facility follows cleanroom protocols throughout the entire facility in order to achieve the necessary yields for the technical nature of the products that are manufactured in the facility.
Tom Edman, President and CEO of TTM stated, “TTM is proud to host this grand opening and announce this exciting news. The efforts of our employees to rapidly transform this building and successfully transfer the i3 production and technology from New York to Wisconsin was remarkable. The resulting new Advanced Technology Center is now one of the most advanced microelectronics production facilities in North America, and allows TTM to offer more advanced technological solutions to its customer base in North America. This stands as a true testament to TTM’s commitment to technology leadership for our customers, supporting them with enabling advanced technology solutions around the globe.”
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
DARPA, State of New Mexico Establish Framework to Advance Quantum Computing
09/08/2025 | DARPAAs part of the Quantum Benchmarking Initiative (QBI), DARPA signed an agreement with the State of New Mexico’s Economic Development Department to create the Quantum Frontier Project.
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
CEE PCB Launches PCBpedia: A New Knowledge Hub for Circuit Board Technology
09/03/2025 | CEE PCBCEE PCB, a leading manufacturer of PCBs and FPCs, is responding to the growing demand for reliable technical knowledge. With PCBpedia, CEE introduces a new knowledge platform featuring expert articles on key topics in circuit board technology – from FPC design rules to surface finishes.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.