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Flexible PCB Market to Reach $61.75B by 2032, Driven by the Demand for Compact Electronics, Automotive and Medical Applications

05/16/2025 | Globe Newswire
According to the SNS Insider, “The Flexible PCB Market was valued at USD 21.42 billion in 2023 and is expected to reach $61.75 billion by 2032, growing at a CAGR of 12.52% over the forecast period 2024-2032.”

CEE PCB to Exhibit at The Battery Show Europe 2025

05/14/2025 | CEE PCB
Tom Yang, CEO of CEE PCB, has announced that the company will exhibit at The Battery Show 2025, held from June 3-5 at the Messe Stuttgart in Stuttgart, Germany, in Booth F69 in Hall 7.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/02/2025 | Marcy LaRont, PCB007 Magazine
In our industry, this week’s must-read features include CEE’s Tom Yang and his perspective on having a global business amidst tariff talk and other challenges. Joe Fjelstadt talks to the “Flexperts,” Nick Koop of TTM and Mark Finstead of Flexible Circuit Technologies. Nolan Johnson interviews the McGucken Group about the importance of empathic leadership in BANI times. NCAB’s Ryan Miller writes about reliability and compliance for building PCBs for medical applications, and surprise, more news from Siemens.

Elephantech: For a Greener Tomorrow

04/16/2025 | Marcy LaRont, PCB007 Magazine
Nobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.

Real Time With... IPC APEX EXPO 2025: Best Student Technical Paper Winner—Attila Rektor

04/10/2025 | Marcy LaRont, I-Connect007
Attila Rektor, a Ph.D student from Boise State, won the best technical paper award at IPC APEX EXPO 2025. His paper explores enhancing the conductivity of laser-induced graphene for flexible circuits. The research, funded by SAIC, involved modulating surface energy to enable effective copper plating. This breakthrough has potential applications in flexible printed circuit boards, sensing, and biomedical devices.
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