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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Insulectro Appoints Industry Veteran John Odom to Advisory Board
March 9, 2020 | InsulectroEstimated reading time: 1 minute
Insulectro, the largest distributor of materials for use in the printed circuit board and printed electronics industries, has announced the appointment of industry veteran John Odom to its advisory board.
Odom retired from DuPont in 2019 where he had held global leadership roles in printed circuit materials, semiconductor materials, and photovoltaic materials businesses. He had also served on the boards of DA NanoMaterials and HD MicroSystems, leading suppliers of proprietary materials to the semiconductor industry. While at DuPont, Odom also led numerous M&A initiatives and had extensive electronic materials business experience in Asia. During his career Odom has been active in IPC and SEMI, where he chaired the Chemicals and Gases Manufacturers Group and the Strategic Materials Conference.
Odom is a graduate of Clemson University in Chemical Engineering and he received Executive Education at The Wharton School of the University of Pennsylvania.
“John is highly regarded in the electronic materials industry for his market and business expertise, strong customer focus, and personal values,” remarked Insulectro President and CEO, Patrick Redfern. “Insulectro and DuPont have an extensive history and together our companies have led the industry. Through John’s experiences and skills, he brings critical insight and perspective to our Advisory Board, and we are excited to welcome him to the Insulectro team.
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Global Electronics Association Expands Free Member Training Library with New Safety and Ergonomics Courses
04/23/2026 | Global Electronics AssociationThe Global Electronics Association today announced three new complimentary courses in safety and ergonomics, expanding its member training library to help manufacturers onboard workers faster and improve production performance.
A Mic, a Tiny Cam, and the Show Floor: The Story Behind 'Take the Mic!'
04/23/2026 | I-Connect007 Editorial TeamI-Connect007’s Take the Mic! program at APEX EXPO 2026 in Anaheim is proving to be a must-watch feature for this year’s event coverage, as we invited company representatives to participate in a sponsored conversation about their businesses and products in a whole new way: in front of a camera at their booths. While our managing editors and guest editors were conducting slightly longer Real Time With… APEX EXPO interviews in our booth, three staff members and guests acted as roaming reporters, conducting short, prearranged interviews with several companies exhibiting on the show floor.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
Standardization, Workforce, and the Road Ahead for Flex–Packaging Integration, Part 3
04/22/2026 | Anaya Vardya, American Standard CircuitsParts 1 and 2 of this series established the technical foundation and application landscape for the convergence of flexible PCBs and advanced semiconductor packaging. Part 3 addresses what comes next: the standards frameworks, talent pipelines, and strategic imperatives that will determine whether the industry can scale this convergence reliably and competitively.
New Guidance Targets Scope 3.1 Emissions Gap in Electronics Supply Chains
04/22/2026 | I-Connect007 Editorial TeamA new industry guidance document aimed at improving how electronics companies account for Scope 3 Category 1 (Scope 3.1) emissions marks a significant step toward more consistent and effective supply chain decarbonization. A recent webinar hosted by the Global Electronics Association and the Responsible Business Alliance (RBA) addressed a persistent challenge: Despite the material impact of Scope 3.1 emissions, fewer than half of electronics companies currently report them.