-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on North America
A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing.
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
STI Electronics to Present on the New J-STD-001 Section 8.1 on Electronic Assembly Cleanliness
March 11, 2020 | STI Electronics, Inc.Estimated reading time: 1 minute
STI’s Mark McMeen, VP, Engineering Services, will have a special presentation on How does one collect “Objective Evidence” to meet the new J-STD-001 Section 8.1 on electronic assembly cleanliness? The presentation take place at STI Electronics Inc.’s facility in Madison, AL on March 26, 2020 at 3 p.m. and will explore why this IPC standard came about and why the current “ROSE” test methodology is not enough for today’s advanced designs. It will explore different tools and techniques as well as discuss how to gather objective evidence needed to meet the specification. There will be an actual demonstration of the equipment and test reports that are generated by the SIR test equipment along with the actual hardware that generates the test data that supports “Objective Evidence” for review. Do you know how “clean or dirty” your electronic manufacturing process and resulting hardware/assemblies are at completion?
Mark T. McMeen joined STI Electronics Inc. as Vice President of Engineering Services in July 2000. Prior to joining STI, Mr. McMeen was the Vice President of Engineering and Technical Director of Component Intertechnologies, Inc. He currently oversees the daily operations of the Engineering Services division of STI, which incorporates three entities: Analytical, Prototype and Manufacturing and Microelectronics Lab. He has more than 30 years of experience in the engineering and manufacturing of printed circuit boards, both flexible and rigid, as well as in the manufacture of electronic assemblies. He currently holds two co-patents in the fabrication of flexible circuit boards and the processes necessary to imbed integrated circuits inside rigid printed circuit boards. He is also one of the co-inventers in the development of the Magnalytix commercially available SIR test equipment (Magnalytix is a joint venture between STI Electronics and KYZEN).
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung
05/08/2026 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung.
Foxconn, ElectroMobility Poland in Strategic Partnership to Develop Electric Vehicle Ecosystem
05/08/2026 | FoxconnHon Hai Technology Group (Foxconn) plans to accelerate the development of clean mobility in the European region in strategic partnership with state-backed ElectroMobility Poland S.A. (EMP), the key driver of an ambitious initiative to raise the technological and operational capabilities of the electric vehicle ecosystem in Poland and the broader region.
Flex Plans Cloud and Power Unit Spin-Off
05/08/2026 | FlexFlex announced that its Board of Directors has unanimously approved moving forward with a plan to spin off its Power and Cloud portfolio from Flex, creating two independent, publicly traded companies, each optimally positioned to serve their customers and create value for their shareholders.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.