Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

Heller and Seho Investing in Mexico

09/09/2026 | Nolan Johnson, SMT007 Magazine
Heller Industries is the leading provider of thermal systems in the electronics assembly and semiconductor industries, manufacturing a wide range of equipment, primarily for standard reflow applications in electronics assembly. The company has realized significant business growth in Mexico in recent years and is now preparing for SMTA Guadalajara. Paul Lancaster, vice president of sales and marketing, spoke about the Mexican market, growing a local support infrastructure, and partnering with Seho.

Indium to Explore the Critical Materials and Packaging Process Connection at CPRIM 2026

09/01/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Luis Pan will discuss how precisely matching materials and assembly processes can positively impact yield and reliability at the Conference on Advanced Packaging Reliability Technology and Interconnect Materials (CPRIM) 2026, September 4, in Guangzhou, China.

Javelin JV, Tata Advanced Systems Sign India Missile Co-Production Deal

08/31/2026 | Lockheed Martin
Tata Advanced Systems Limited and the Javelin Joint Venture (JJV), a partnership between Raytheon, an RTX business, and Lockheed Martin, have entered into a memorandum of understanding (MOU) for the co-production of the Javelin All Up Round (AUR) in India.

PCBA Market Surges to $168.90 Billion at a CAGR of 5.1% by 2035

08/28/2026 | Globe Newswire
As per the SNS Insider, “The Printed Circuit Board Assembly Market size was worth USD 102.30 billion in 2025 and is projected to reach USD 168.90 billion by 2035, registering a CAGR of 5.1% from 2026 to 2035.”

Indium to Present Materials Solutions for the Next Wave of Power Electronics at CIPA 2026

08/26/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Leo Hu will examine the keys to precisely matching the diverse process requirements of power module packaging and assembly at CIPA 2026, August 31-September 2, in Wuxi, China.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in