Rehm Introduces Seamless Traceability of Machine Data
March 20, 2020 | Rehm Thermal SystemsEstimated reading time: 3 minutes

Hermes networking is now possible with Rehm systems—no data loss at the outlet due to Separo separation module.
In Greek mythology, the messenger of the gods, Hermes, carries the messages of the gods to mortals. With his quick and clever way he moves freely between the two worlds. No wonder that his name was chosen for a new interface communication: "The Hermes Standard". It ensures that important assembly information is transmitted reliably, spontaneously, easily and completely from machine to machine and to higher-level systems—regardless of the machine's manufacturer. The convection soldering systems VisionXP+ and VisionXP+ Vac from Rehm Thermal Systems are also available with "The Hermes Standard" and the Separo separation module.
Efficiency and networking are the keywords that characterize today's industry. For the future of industrial production it is essential that the entire production is networked and that the necessary process and assembly data can be accessed at any time. Especially for SMT lines, which consist of systems from different manufacturers, it is important that the networking is also guaranteed manufacturer-independently across the entire line. With "The Hermes Standard" this is possible without any problems.
"The Hermes Standard:" Horizontal M2M communication
The Hermes Standard directly links the individual machines through horizontal communication. Data is exchanged directly from machine to machine (M2M) on the entire SMT line, the data packets travel through the machine with the printed circuit boards: at the start of the production line there is a scanner that uniquely identifies the PCB. The machine uses this information to create the Hermes data package, which is passed on from machine to machine. However, this is not done via digital signals, but via a network. This new type of interface communication is based on a TCP/IP and XML protocol using standardised cables and data formats. This simplifies the integration process and reduces costs. In addition to the module's barcode, various data is also stored and communicated.
With or without scanner at the outlet
Customers of Rehm Thermal Systems can choose between two variants if they want a Hermes interface communication for VisionXP+ or VisionXP+ Vac: Either with a scanner on the outfeed conveyor, or without. Without a scanner at the outfeed conveyor it is not possible to manually reinsert a board (Reinsert). This reduces the risk of losing data or assigning wrong boards. If there is a scanner on the outfeed conveyor, the boards can be removed after the soldering process and re-inserted as required. This is particularly necessary if a manual visual inspection is to be carried out or samples are to be taken for quality assurance processes. An assignment of the data to the correct board remains, however.
Separation of the boards by Separo
Regardless of whether or not there is a scanner at the outfeed conveyor, the convection soldering systems VisionXP+ and VisionXP+ Vac are available with the Separo separation module. This is part of the machine and therefore fully integrated. If, for example, there is a jam of the assemblies in the cooling zones, the Separo separates the assemblies again at the outfeed to ensure correct and complete data transfer and to prevent loss of data.
The vision systems from Rehm are also ready for CFX. With the CFX interface (IPC-CFX), communication is network-based vertical. While the Hermes standard is mainly used for M2M communication, the CFX is used for data upload and download as well as data analysis. The combination of horizontal Hermes communication and vertical CFX communication is absolutely essential for the Smart Factory in the long term and represents a further step towards standardisation.
About Rehm Thermal Systems
As a specialist in the field of thermal system solutions for the electronics and photovoltaic industry, Rehm is one of the technology and innovation leaders in the modern and economical production of electronic assemblies. As a globally active manufacturer of reflow soldering systems with convection, condensation or vacuum, drying and coating systems, function test systems, equipment for the metallization of solar cells as well as numerous customer-specific special systems, we are represented in all relevant growth markets and, as a partner with 30 years of experience in the industry, we realize innovative manufacturing solutions that meet standard requirements.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
03/14/2025 | Nolan Johnson, I-Connect007Inside the industry, it feels like we’re getting ready for a big party holiday, and I’m feeling the whole Mardi Gras vibe. This weekend, IPC APEX EXPO kicks off with standards development committees and the Technical Conference before the Expo starts on March 18. We’ll be sneaking out of our network of evil lairs scattered around North America and convening at the I-Connect007 booth in the middle of the Anaheim Convention Center. Be sure to stop by and say hello.
IPC Hall of Fame Spotlight Series: Highlighting Denny Fritz
03/13/2025 | Dan Feinberg, I-Connect007This month, the Hall of Fame spotlight features Denny Fritz, a long-time friend and associate of mine. Denny first got involved with IPC in 1978 while working with MacDermid. His first efforts were with the various board fabrication committees, something he believes helped lead to his eventual Hall of Fame award.
IPC Asia’s Talent Development Program Opens Pathways to a More Qualified Workforce
03/14/2025 | Evelyn Cui, IPC AsiaIn Asia, the contradiction between the rapid development of the electronics manufacturing industry and the shortage of talent is particularly evident. The existing talent pool cannot fully meet the market's demand for highly skilled professionals. According to feedback from industry companies, there is an urgent need for professionals with knowledge of IPC standards and practical skills in electronics. However, the reality is that most academic courses are disconnected from the actual needs of the industry, leading to disappointing results when companies recruit from universities and schools.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
IPC Releases Latest List of Standards and Revisions
03/12/2025 | IPCEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.