Rehm Introduces Seamless Traceability of Machine Data
March 20, 2020 | Rehm Thermal SystemsEstimated reading time: 3 minutes

Hermes networking is now possible with Rehm systems—no data loss at the outlet due to Separo separation module.
In Greek mythology, the messenger of the gods, Hermes, carries the messages of the gods to mortals. With his quick and clever way he moves freely between the two worlds. No wonder that his name was chosen for a new interface communication: "The Hermes Standard". It ensures that important assembly information is transmitted reliably, spontaneously, easily and completely from machine to machine and to higher-level systems—regardless of the machine's manufacturer. The convection soldering systems VisionXP+ and VisionXP+ Vac from Rehm Thermal Systems are also available with "The Hermes Standard" and the Separo separation module.
Efficiency and networking are the keywords that characterize today's industry. For the future of industrial production it is essential that the entire production is networked and that the necessary process and assembly data can be accessed at any time. Especially for SMT lines, which consist of systems from different manufacturers, it is important that the networking is also guaranteed manufacturer-independently across the entire line. With "The Hermes Standard" this is possible without any problems.
"The Hermes Standard:" Horizontal M2M communication
The Hermes Standard directly links the individual machines through horizontal communication. Data is exchanged directly from machine to machine (M2M) on the entire SMT line, the data packets travel through the machine with the printed circuit boards: at the start of the production line there is a scanner that uniquely identifies the PCB. The machine uses this information to create the Hermes data package, which is passed on from machine to machine. However, this is not done via digital signals, but via a network. This new type of interface communication is based on a TCP/IP and XML protocol using standardised cables and data formats. This simplifies the integration process and reduces costs. In addition to the module's barcode, various data is also stored and communicated.
With or without scanner at the outlet
Customers of Rehm Thermal Systems can choose between two variants if they want a Hermes interface communication for VisionXP+ or VisionXP+ Vac: Either with a scanner on the outfeed conveyor, or without. Without a scanner at the outfeed conveyor it is not possible to manually reinsert a board (Reinsert). This reduces the risk of losing data or assigning wrong boards. If there is a scanner on the outfeed conveyor, the boards can be removed after the soldering process and re-inserted as required. This is particularly necessary if a manual visual inspection is to be carried out or samples are to be taken for quality assurance processes. An assignment of the data to the correct board remains, however.
Separation of the boards by Separo
Regardless of whether or not there is a scanner at the outfeed conveyor, the convection soldering systems VisionXP+ and VisionXP+ Vac are available with the Separo separation module. This is part of the machine and therefore fully integrated. If, for example, there is a jam of the assemblies in the cooling zones, the Separo separates the assemblies again at the outfeed to ensure correct and complete data transfer and to prevent loss of data.
The vision systems from Rehm are also ready for CFX. With the CFX interface (IPC-CFX), communication is network-based vertical. While the Hermes standard is mainly used for M2M communication, the CFX is used for data upload and download as well as data analysis. The combination of horizontal Hermes communication and vertical CFX communication is absolutely essential for the Smart Factory in the long term and represents a further step towards standardisation.
About Rehm Thermal Systems
As a specialist in the field of thermal system solutions for the electronics and photovoltaic industry, Rehm is one of the technology and innovation leaders in the modern and economical production of electronic assemblies. As a globally active manufacturer of reflow soldering systems with convection, condensation or vacuum, drying and coating systems, function test systems, equipment for the metallization of solar cells as well as numerous customer-specific special systems, we are represented in all relevant growth markets and, as a partner with 30 years of experience in the industry, we realize innovative manufacturing solutions that meet standard requirements.
Suggested Items
IPC Rebrands as Global Electronics Association: Interview With Dr. John W. Mitchell
06/22/2025 | Marcy LaRont, I-Connect007Today, following a major announcement, IPC is embracing the rapid advancement of technology with a bold decision to change its name to the Global Electronics Association. This name more accurately reflects the full breadth of its work and the modern realities of electronics manufacturing. In this exclusive interview, Global Electronics Association President and CEO Dr. John W. Mitchell shares the story behind the rebrand: Why now, what it means for the industry, and how it aligns with the organization’s mission.
Global Electronics Association Debuts; New Name Elevates IPC’s 70-Year Legacy as Voice of $6 Trillion Electronics Industry
06/25/2025 | Global Electronics AssociationToday begins a new chapter for IPC as it officially becomes the Global Electronics Association, reflecting its role as the voice of the electronics industry. Guided by the vision of “Better electronics for a better world,” the Global Electronics Association (electronics.org) is dedicated to enhancing supply chain resilience and promoting accelerated growth through engagement with more than 3,000 member companies, thousands of partners, and dozens of governments across the globe.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/20/2025 | Andy Shaughnessy, I-Connect007It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication and assembly communities. Some of this news is out of this world. We may be losing the high ground—the really high ground. Columnist Jesse Vaughan explains how the U.S. seems to be falling behind in space, and how this could affect our ability to defend ourselves in the future. We have an update on the U.S.-China tariff talks, which seem to be moving forward, though sometimes at a snail’s pace.
New IPC VP Joe Schneider Building Stronger Focus on U.S., Canada
06/19/2025 | Marcy LaRont, I-Connect007IPC has hired Joe Schneider as a vice president to strengthen its regional focus and address the specific needs in the U.S. and Canada. Joe brings a rich background in OEM and contract manufacturing, including with industry giants like Siemens and Abbott Laboratories. In this interview, he shares his vision for the region, which emphasizes workforce development and supply chain challenges.
IPC Update on the Latest U.S.– China Trade Announcement
06/18/2025 | IPCOn June 12, the Trump Administration announced an agreement to implement the framework of the trade deal with China reached earlier in May. Reports indicate the following high-level terms: A 55% combined tariff on imports from China, 10% “reciprocal” tariffs under the International Emergency Economic Powers Act (IEEPA), 20% IEEPA-based fentanyl tariffs, and Existing Section 301 tariffs, which in many cases are 25%.