Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
What’s Driving AOI Innovation and Collaboration?
March 25, 2020 | Brent Fischthal, Koh Young AmericaEstimated reading time: 1 minute
Industry 4.0 Discussion
Big data is the foundation for Industry 4.0, so advanced inspection systems must evolve from simply judging “pass/fail” tools into highly intuitive, dynamic decision-making systems that emphasize the need for reliable, traceable data. Artificial intelligence (AI) engines can empower tools to help customers analyze and optimize the production process by managing process data from connected SPI and AOI systems.
When we look at the optical inspection market growth trajectory, we can see how process challenges helped create innovations. For example, solder paste inspection (SPI) has undergone a shift from 2D to 3D because the 2D inspection technologies manufacturers traditionally used to collect solder deposit images could not solve shadowing problems. Thus, companies developed 3D SPI to capture the printed solder paste height to accurately measure the total volume of paste printed. Several years later, we see the same need for surface-mounted component inspection with AOI systems.
As today’s board complexity is increasing with more components and joints, higher density, and shrinking package technologies, such as the 0201 metric (008004 imperial) microchips (Figure 1), basic AOI technologies using blob analysis or high megapixel cameras may no longer be practical. Most decisions made are based on a “good/bad” comparison of reference images, which can easily be affected by variables like component surface finish, board condition, component proximity, and more.
Although 2D AOI is still a technology in the market, more manufacturers are adopting 3D AOI to increase board quality. The benefits are clear. Using clearly defined thresholds backed by accurate data will eliminate the need to constantly debug inspection programs. Moreover, measurement data generated from some 3D AOIs provides meaningful insights about the process and helps eliminate the root causes of a defect. Combining a 3D SPI with 3D AOIs enables manufacturers to accurately control and monitor the board assembly process.
To read this entire article, which appeared in the February 2020 issue of SMT007 Magazine, click here.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.