Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

BAE Systems Wins Space Force Contract for Resilient Satellite Communications Terminals

10/19/2026 | BAE Systems
BAE Systems has been awarded a contract from the U.S. Space Force Space Systems Command (SSC) to design and demonstrate ultra-compact radio-frequency (RF) terminals for a space-based data layer.

Enabling the Interconnect Technologies That Transform Our World: MKS’s Strategic Role in Powering the Future of AI and HPC

10/20/2026 | By John T.C. Lee, with Won Lee (VSD), Marc Tricard (PSD), and Kuldip Johal (MSD), MKS Inc.
AI is reshaping industries, economies, and daily life at an unprecedented speed. From generative AI and autonomous systems to high-performance computing (HPC) applications in science, defense, and advanced manufacturing, the demand for computational power is accelerating exponentially. But while algorithms capture the spotlight, the true enabler of this transformation lies deeper, in the physical infrastructure that makes AI possible. Performance in the AI era is no longer defined by transistor shrink alone. It is increasingly defined by how efficient systems are integrated, interconnected, cooled, and manufactured at scale.

The Future of Warfare Is Driving Billions Into Next-Generation Soldier Systems

10/15/2026 | Globe Newswire
The modern battlefield is changing fast, and soldiers need equipment that can keep pace. Military forces around the world are investing in advanced body armor, night vision, thermal imaging, secure communications, wearable technology and AI-powered systems that help troops see threats sooner and make faster decisions.

Draper Breaks Ground on New Microelectronics Building in Lowell

10/14/2026 | Draper Laboratory
Draper recently held a groundbreaking ceremony for a new microelectronics building in Lowell, Massachusetts. The building will house Draper's Integrated Microelectronics Production & Advanced Chip Technology (IMPACT) Center.  

LITEON September Sales Rise 22% on Strong AI and Cloud Demand

10/14/2026 | LITEON Technology
LITEON’s consolidated revenue for September reached NT$18.8 billion, representing a 22% Y-o-Y increase.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in