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Mycronic’s Board of Directors Proposes Changed Dividend
March 26, 2020 | Mycronic ABEstimated reading time: Less than a minute
Due to the great uncertainty created by the spread of the coronavirus, the Board of Directors of Mycronic AB (publ) has decided to propose the Annual General Meeting on May 7, 2020 that the dividend is changed from the earlier communicated 3.25 SEK per share, to a dividend of 2.00 SEK per share.
”After the record year 2019 Mycronic has a strong financial position and liquidity. The company wants to be well prepared to take advantage of future opportunities that might arise and the Board of Directors therefore wishes to be prudent. Considering the prevailing uncertainty, the proposal is well-balanced”, says Anders Lindqvist, President and CEO at Mycronic.
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ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
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Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Zhen Ding Expands PCB into Semiconductors at SEMICON Taiwan 2025; Advantech Drives AI Smart Parks
09/12/2025 | Zhen DingZhen Ding Technology Holding Co., Ltd., a global leader in the PCB industry, returned to exhibit at SEMICON Taiwan 2025. Positioning itself as an industry pioneer in "PCB expanding into semiconductors," the company showcased its latest strategic layout
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.