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Specially Developed for Laser Plastic Welding: Thermography with TherMoPro Opens New Possibilities

06/25/2025 | LPKF
LPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.

Excellon Installs COBRA Hybrid Laser at Innovative Circuits

06/23/2025 | Excellon
Excellon is pleased to announce the successful installation of a second COBRA Hybrid Laser System at Innovative Circuits, located in Alpharetta, Georgia. The Excellon COBRA Hybrid Laser System uniquely combines both UV and CO₂ (IR) laser sources on a single platform—making it ideal for high-density prototype and production printed circuit boards (PCBs).

Smart Automation: The Power of Data Integration in Electronics Manufacturing

06/24/2025 | Josh Casper -- Column: Smart Automation
As EMS companies adopt automation, machine data collection and integration are among the biggest challenges. It’s now commonplace for equipment to collect and output vast amounts of data, sometimes more than a manufacturer knows what to do with. While many OEM equipment vendors offer full-line solutions, most EMS companies still take a vendor-agnostic approach, selecting the equipment companies that best serve their needs rather than a single-vendor solution.

OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding

06/21/2025 | BUSINESS WIRE
OKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.

Sierra Circuits Boosts High Precision PCB Manufacturing with Schmoll Technology

06/16/2025 | Schmoll Maschinen
Sierra Circuits has seen increased success in production of multilayer HDI boards and high-speed signal architectures through the integration of a range of Schmoll Maschinen systems. The company’s current setup includes four MXY-6 drilling machines, two LM2 routing models, and a semi-automatic Optiflex II innerlayer punch.
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