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Mercury Receives Largest Production Order for its Common Processing Architecture Servers

05/29/2026 | Globe Newswire
Mercury Systems, Inc., a global leader in aerospace and defense electronics, announced it received a multi-year contract to deliver 1,000 of its RTBX06 BuiltSECURE™ servers to Blue Raven, a leading distributor in the defense industry.

Apprenticeship Summit Highlights Electronics Workforce ‘Puzzle’

05/27/2026 | Victoria Hawkins, Global Electronics Association
Last week, I had the opportunity to attend the 2026 Apprenticeships for America Summit in Washington, D.C., and it was both energizing and informative to be surrounded by so many leaders working to strengthen and scale apprenticeships across the country. The summit brought together employers, intermediaries, workforce leaders, educators, policy experts, and apprenticeship advocates to discuss some of the most important topics in our field

Three Key Takeaways on Material Management From Cogiscan’s Latest White Papers

05/27/2026 | I-Connect007 Editorial Team
Effective material management has become increasingly critical as PCB assembly operations face mounting pressure to improve efficiency, control costs, and maintain quality in complex manufacturing environments. To help electronics manufacturers navigate these challenges, Cogiscan has contributed two complementary white papers to the I-Connect007 Industry Resource Center, offering practical strategies for improving material visibility, traceability, and production performance.

BAE Systems Announces Facility Upgrades to Enhance U.S. Military Readiness

05/25/2026 | BAE Systems
BAE Systems announced a $135 million investment for facility enhancements in Austin, Texas and Hudson, New Hampshire, further strengthening the U.S. defense industrial base.

Innovative Flash Copper Plating Technology

05/21/2026 | Andreas Schatz and Mustafa Özkök, MKS’ Atotech
The continuous push toward higher functionality, miniaturization, and performance in modern electronic devices—such as smartphones, wearables, and advanced computing platforms—has intensified the demand for high-density interconnect (HDI) printed circuit boards. Central to HDI performance is the reliable formation of blind microvias (BMVs), which serve as critical interlayer connections in modified semi-additive processes (mSAP).
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