Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
LPKF Expands Sales Force in Taiwan
April 7, 2020 | LPKF Laser & ElectronicsEstimated reading time: 1 minute
LPKF announces that SIGMA Technology Corporation began marketing LPKF laser systems for depaneling in March 2020.
In the production of printed circuit boards, the depaneling process is one of the decisive factors in determining how quickly and economically the entire production process can be carried out. Laser technology is used especially for high-quality printed circuit boards. LPKF offers a broad portfolio of high-end laser systems for depaneling. With SIGMA Technology in Taiwan, LPKF has brought an experienced distributor on board to sell this product segment.
Laser technology offers the ideal solution for cutting printed circuit boards with irregular contours and/or high packing density: Cuts can be made directly at the edge of conductor paths or components—without causing unnecessary stress on the PCB or the parts. Complex geometries can be easily realized. Even rigid PCBs with simpler contours can now be manufactured very economically with laser technology. Thanks to the innovative LPKF CleanCut technology, the cut edges can be produced with unprecedented technical cleanliness - at a machining speed competitive with the milling process, and with a very good price-performance ratio.
LPKF has been at the forefront of laser technology for more than 30 years and has various systems in its portfolio for different applications and requirements. The laser depaneling machines are successfully used by market-leading companies around the world. In Taiwan, the systems of the LPKF CuttingMaster as well as the LPKF Micro- and LPKF Pico-Series are also distributed by SIGMA Technology Corporation now. LPKF is thus creating an even more solid sales base in the Asian region.
SIGMA Technology Corp. was established in 2004, while the former entity SIGMA has already entered the electronics business in 1972. The Company is an integrated supplier of capital equipment, instruments and consumable material for front-end wafer manufacturing, back-end IC packaging houses, Surface Mount Technologies, solar cells, fuel cells, LED packages and graphics inkjet.
About LPKF
LPKF Laser & Electronics AG is a leading provider of laser-based solutions for the technology industry. Laser systems from LPKF are of central importance for the manufacturing of printed circuit boards, microchips, automotive parts, solar modules and many other components. Founded in 1976, the company has its headquarters in Garbsen near Hanover and operates worldwide through subsidiaries and agencies. Around 20% of the workforce is engaged in research and development.
Share on:
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).