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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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SMTA Renames Event as Microelectronics Packaging & Integration Symposium

10/20/2026 | SMTA
TA is pleased to announce a new name and expanded technical scope for the former Wafer-Level Packaging Symposium.

Sypris Receives Follow-On Award for Mission-Critical U.S. Navy Program Share

10/14/2026 | Sypris Electronics LLC
Sypris Electronics, LLC, a subsidiary of Sypris Solutions, Inc., announced that it has received a follow-on award to manufacture and test electronic power supplies for a large, mission-critical U.S. Navy program.

ESGS 2026 to Drive Innovation Across the Electronic Gases Ecosystem

09/25/2026 | SEMI
The Electronic Specialty Gases & Systems Conference (ESGS) 2026 will bring together leaders across the electronic gases value chain November 10-12, 2026, at the Hyatt Regency Phoenix in Arizona.

Yamaha Robotics to Focus on Assembly and Inspection Innovations at EFX 2026 in Stuttgart

09/22/2026 | Yamaha Robotics
Yamaha Robotics will show visitors to EFX 2026, the Expo for Electronics Manufacturing, in Stuttgart from October 6-8, how advanced surface-mount automation helps companies grow their business and increase productivity.

Marel Power Solutions Secures $1.9M to Scale Power Electronics Manufacturing

09/21/2026 | PRNewswire
Marel Power Solutions, Inc. announced that it has been awarded $1.9 million through the Michigan Supplier Conversion Grant Program, administered by the Michigan Department of Labor and Economic Opportunity (LEO).
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