Nano Dimension and Piezoskin Developed a Customized 3D-Printed MEMS Package with Electric Pads
April 15, 2020 | Nano Dimension Ltd.Estimated reading time: Less than a minute
Nano Dimension Ltd., a leading Printed electronics (PE) / Additively Manufactured Electronics (AME) provider, announced today that its technology, DragonFly LDM system and materials were used to develop a 3D printed sealed packaging with electrical pads for Micro-Electromechanical Systems (MEMS).
The printed electronics package has the electrical pads directly printed on the metal layers on which an RF connector is soldered. The ability to transfer electric pads in a sealed package is one of the most crucial parts in ohmic-contact microelectromechanical systems (MEMS) as it determines the device performance and reliability, particularly for soft and flexible devices where the electrical connectors are typically difficult to produce.
“Nano Dimension’s AME technology helped us to achieve an original product prototype in which wires and connectors were eliminated such that the package was minimized to obtain an optimal user experience. It simplifies the manufacturing process compared to traditional manufacturing methods,” said Dr. Francesco Guido, CTO of Piezoskin S.R.L.
“With the DragonFly LDM 3D printer, Piezoskin can design customized printedpackages with flexible transducers, to meet their customers unique needs, drive innovation and get products to market faster,” said Mr. Yoav Stern, Nano Dimension’s CEO and President.
Suggested Items
Indium Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC
05/16/2024 | Indium CorporationIndium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado.
Siemens, Foxconn Team Up to Optimize Forward-thinking Manufacturing
05/16/2024 | FoxconnSiemens AG, a leading technology company, and Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer, have signed a memorandum of understanding (MoU) to drive digital transformation and sustainability in smart manufacturing platforms.
TactoTek Licenses IMSE Technology to Polestar for Sustainable Electronics Design Innovation
05/15/2024 | TactoTekPolestar, the Swedish electric performance car brand, and Finnish smart surface pioneer TactoTek, have entered a collaboration to explore integration of Injection Molded Structural Electronics (IMSE) technology into Polestar’s vehicle programs.
SiPearl: Partnership with Samsung Electronics for built-in HBM in Rhea
05/14/2024 | BUSINESS WIRESiPearl, the company building the high-performance low-power European microprocessor for HPC and AI inference, has signed a partnership with Samsung Electronics Co. Ltd., a world leader in advanced memory technology, to equip its Rhea series with Samsung’s advanced memory solution ideal for HPC and AI applications.
ispace EUROPE, CDS Sign Payload Service Agreement to Transport Precise Location Measurement Technology to the Moon
05/14/2024 | BUSINESS WIREispace EUROPE S.A., the Luxembourg-based subsidiary of ispace, inc., and Control Data Systems SRL (CDS) have signed a payload services agreement to transport precise location measurement equipment to the Moon, the two companies announced.